Izingxenye eziyinhloko ze-Multilayer FPC PCB

Amabhodi wesekethe aphrintiwe we-Multilayer flexible (FPC PCB) ayizingxenye ezibalulekile ezisetshenziswa ezinhlobonhlobo zezinto zikagesi, kusukela kuma-smartphone namaphilisi kuya emishinini yezokwelapha nezinhlelo zezimoto.Lobu buchwepheshe obuthuthukisiwe bunikeza ukuguquguquka okukhulu, ukuqina kanye nokudluliswa kwesignali okuphumelelayo, okwenza kufuneke kakhulu emhlabeni wedijithali osheshayo wanamuhla.Kulokhu okuthunyelwe kwebhulogi, sizoxoxa ngezinto ezibalulekile ezakha i-FPC ye-multilayer PCB kanye nokubaluleka kwazo ezinhlelweni zikagesi.

1. I-substrate eguqukayo:

I-substrate eguquguqukayo iyisisekelo se-multilayer FPC PCB.Inikeza ukuguquguquka okudingekayo kanye nobuqotho bemishini ukuze umelane nokugoba, ukugoqa nokusonteka ngaphandle kokuphazamisa ukusebenza kwe-elekthronikhi.Imvamisa, izinto ze-polyimide noma i-polyester zisetshenziswa njengesisekelo substrate ngenxa yokuzinza kwazo okuhle kakhulu kokushisa, ukufakwa kukagesi, kanye nekhono lokusingatha ukunyakaza okuguquguqukayo.

2. Isendlalelo esiqhutshwayo:

Izendlalelo ze-conductive ziyizingxenye ezibaluleke kakhulu ze-FPC ye-multilayer ngoba zisiza ukuhamba kwamasignali kagesi kusekethe.Lezi zingqimba ngokuvamile zenziwe ngethusi, eline-conductivity kagesi enhle kakhulu kanye nokumelana nokugqwala.I-foil yethusi i-laminated ku-substrate eguquguqukayo isebenzisa i-adhesive, futhi inqubo yokunamathisela elandelayo iyenziwa ukuze kwakhiwe iphethini yesifunda oyifunayo.

3. Isendlalelo se-insulation:

Izendlalelo ezivikelayo, ezaziwa nangokuthi izendlalelo ze-dielectric, zibekwe phakathi kwezingqimba eziqhutshwayo ukuvimbela izikhindi zikagesi futhi zinikeze ukuhlukaniswa.Zenziwe ngezinto ezahlukahlukene ezifana ne-epoxy, i-polyimide noma imaski ye-solder, futhi zinamandla aphezulu e-dielectric nokuzinza kokushisa.Lezi zendlalelo zidlala indima ebalulekile ekugcineni ubuqotho besignali kanye nokuvimbela ukungqubuzana phakathi kokulandela umkhondo we-conductive oseduze.

4. Imaski ye-solder:

Imaski ye-Solder iyisendlalelo sokuvikela esisetshenziswa ezendlalelo ezibambayo nezivikelayo ezivimbela amasekhethi amafushane ngesikhathi sokusoda futhi ivikele iminonjana yethusi ezicini zemvelo ezifana nothuli, umswakama kanye ne-oxidation.Zivamise ukuba luhlaza ngombala kodwa zingabuye zibe ngeminye imibala njengobomvu, oluhlaza okwesibhakabhaka noma omnyama.

5. Imbondela:

I-Coverlay, eyaziwa nangokuthi ifilimu yekhava noma ifilimu yekhava, iyisendlalelo esivikelayo esisetshenziswa endaweni engaphandle ye-FPC PCB enezingqimba eziningi.Inikeza ukufakwa okwengeziwe, ukuvikelwa kwemishini kanye nokumelana nomswakama nokunye ukungcola.Izembozo ngokuvamile zinezikhala zokubeka izingxenye futhi zivumela ukufinyelela okulula kumaphedi.

6. I-Copper Plating:

I-Copper plating iyinqubo yokufaka ungqimba oluncane lwethusi nge-electroplating kungqimba olubambayo.Le nqubo isiza ukuthuthukisa ukusebenza kukagesi, i-impedance ephansi, futhi ithuthukise ubuqotho besakhiwo se-multilayer FPC PCBs.I-Copper plating iphinde yenze kube lula ukulandela umkhondo we-fine-pitch kumasekhethi asondelene kakhulu.

7. Ngezindlela:

I-Via iyimbobo encane ebhobozwe ezendlalelo eziqhutshwayo ze-FPC PCB enezingqimba eziningi, exhuma isendlalelo esisodwa noma ngaphezulu ndawonye.Zivumela ukuxhumana okuqondile futhi zinike amandla umzila wesignali phakathi kwezendlalelo ezihlukene zesekethe.I-Vias ivamise ukugcwaliswa ngethusi noma nge-conductive paste ukuze kuqinisekiswe ukuxhumana okuthembekile kukagesi.

8. Amaphedi ezingxenye:

Amaphedi ezingxenye izindawo eziku-FPC PCB enezingqimba eziningi ezikhethelwe ukuxhuma izingxenye ze-elekthronikhi njengezimelaphi, ama-capacitor, amasekhethi ahlanganisiwe, nezixhumi.Lawa maphedi ngokuvamile enziwe ngethusi futhi axhunywe emithonjeni engaphansi ye-conductive esebenzisa i-solder noma i-adhesive conductive.

Ngokufigqiwe:

Ibhodi lesifunda eliphrintiwe elinezingqimba eziningi (FPC PCB) liyisakhiwo esiyinkimbinkimbi esakhiwe izingxenye ezimbalwa eziyisisekelo.Ama-substrate aguquguqukayo, izendlalelo ze-conductive, izendlalelo ezivikelayo, izifihla-buso, izimbongolo, i-copper plating, i-vias kanye nama-pads ezingxenye zisebenza ndawonye ukuze zinikeze uxhumano oludingekayo lukagesi, ukuguquguquka kwemishini nokuqina okudingekayo emishinini yesimanje kagesi.Ukuqonda lezi zingxenye ezinkulu kusiza ekwakhiweni nasekukhiqizeni ama-FPC PCB asezingeni eliphezulu ahlangabezana nezidingo eziqinile zezimboni ezahlukahlukene.