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4 Layers Flexible PCB Prototype for Medical Blood Pressure Device

I-4 Layers Flexible PCB Prototype ye-Medical Blood Pressure Device-Case

Izidingo zobuchwepheshe
Uhlobo lomkhiqizo Flex Circuit Board
Inombolo yesendlalelo 4 Izendlalelo / Multilayer Flexible Pcb
Ububanzi bomugqa nesikhala somugqa 0.12/0.15mm
Ukujiya kwebhodi 0.2mm
Ukuqina Kwethusi 35 um
Imbobo Encane 0.2mm
I-Flame Retardant 94v0
Ukwelashwa Okungaphezulu Igolide lokucwiliswa
Umbala Wemaski Solder Mnyama
Ukuqina Ishidi Lensimbi
Isicelo Idivayisi Yezokwelapha
Idivayisi yohlelo lokusebenza Ukushaya kwegazi
I-Capel's Advanced Circuits Flex PCB iyibhodi lesifunda eliphrintiwe elinezingqimba ezi-4 (PCB) elakhelwe ngokukhethekile imishini yezokwelapha.Isetshenziswa kakhulu emishinini yomfutho wegazi.
I-Capel's Advanced Circuits Flex PCB iyibhodi lesifunda eliphrintiwe elinezingqimba ezi-4 (PCB) elakhelwe ngokukhethekile imishini yezokwelapha.Isetshenziswa kakhulu emishinini yomfutho wegazi.

Ucwaningo lwesigameko

I-Capel's Advanced Circuits Flex PCB iyibhodi lesifunda eliphrintiwe elinezingqimba ezi-4 (PCB) elakhelwe ngokukhethekile imishini yezokwelapha.Isetshenziswa kakhulu emishinini yomfutho wegazi.

Lo mkhiqizo uhlanganisa izinto ezintsha zobuchwepheshe ukuze uthuthukise ukusebenza kwawo kanye nokusebenza kwawo embonini yemishini yezokwelapha.

Inombolo Yezendlalelo:
Idizayini enezendlalelo ezi-4 ye-PCB ikhombisa izinga eliphezulu lobunkimbinkimbi nokusebenza.Ngokuhlanganisa izendlalelo eziningi, ama-PCB angakwazi ukumumatha ukujikeleza okuminyene, okuvumela ukudluliswa kwesignali okungcono nokuncipha kwe-crosstalk.Lesi sici esisha siqinisekisa ukunemba nokuthembeka kwezilinganiso zomfutho wegazi.
Ububanzi bomugqa nesikhala somugqa:
Ngobubanzi bomugqa kanye nesikhala somugqa esingu-0.12 mm no-0.15 mm ngokulandelana, i-PCB eguquguqukayo ye-Capel ibonisa amandla ahlaba umxhwele okwenza i-miniaturization.Ukulandela umkhondo nesikhala kuvumela amasekhethi ayinkimbinkimbi ukuthi akhelwe ezindaweni ezihlangene, okuvumela imishini yezokwelapha ukuthi ibe mancane futhi iphatheke kalula.
Ubukhulu bebhodi:
Ugqinsi lwepuleti elincane kakhulu elingu-0.2mm kungenye indlela entsha yobuchwepheshe yobuchwepheshe be-Capel.Le phrofayela encane ivumela ama-PCB avumelana nezimo ukuthi ahlanganiswe kalula ekwakhiweni kwemishini emincane yezokwelapha ngaphandle kokufaka engozini ukuqina noma ukuqina.
Ugqinsi lwethusi:
Ubukhulu bethusi obungu-35μm buqinisekisa ukusebenza kahle kanye nomthamo owanele wokuthwala wamanje.Njengoba le pharamitha isendaweni, i-PCB eguquguqukayo ye-Capel ingadlulisela kahle futhi isabalalise amasignali kagesi adingekayo ukuze kukale umfutho wegazi.Kuphinde kunciphise ukulahleka kwamandla nokukhiqiza ukushisa, kusize ukuthuthukisa ukusebenza kahle okuphelele kwemishini yezokwelapha.
Imbobo encane:
Ubuncane bosayizi wokuvula ngu-0.2mm, okubonisa ukunemba okuphezulu kwenqubo yokuklama neyokukhiqiza.Lokhu kuqanjwa kabusha kwezobuchwepheshe kunika amandla ukuxhumeka kwesekethe okunembe kakhudlwana, okunciphisa ubungozi bokuphazanyiswa kwesignali noma ukwehluleka.
I-flame retardant:
Ibanga le-94V0 le-flame retardant liqinisekisa ukuthi i-PCB evumelana nezimo ihlangabezana nezindinganiso eziqinile zokuphepha zemboni yezokwelapha.Lesi sici sibalulekile ngoba sivimbela ama-PCB ekuthungeleni noma ekusakazeni imililo, ukuvikela abasebenzisi nezisetshenziswa zezokwelapha ezingozini ezingaba khona.
Ukwelashwa kwendawo:
Ukwelashwa kwendawo yegolide ecwilisiwe kuthuthukisa ukusebenza futhi kuvikela imikhondo yethusi ekugqwaleni.Lokhu kuqanjwa kabusha kwezobuchwepheshe kunweba impilo yesevisi yama-PCB avumelana nezimo futhi kuqinisekise ukuzinza kokuxhunywa kukagesi, ngisho nasezimweni zezokwelapha ezinokhahlo.Umbala Wemaski Solder:
Ukusetshenziswa kombala omnyama wokudambisa ukugoba akunikezeli nje kuphela ukukhanga kobuhle kumkhiqizo kodwa futhi kusebenza njengenkomba ebonakalayo yokuhlukanisa i-PCB eguquguqukayo phakathi nokuhlanganisa.Lokhu kufakwa kwekhodi yombala kwenza kube lula inqubo yokukhiqiza futhi kuqede amathuba okuba namaphutha ekubekweni kwengxenye kanye ne-soldering.

Ukuze kuthuthukiswe imboni nemishini, i-Capel ibheka lokhu kuthuthukiswa kobuchwepheshe okulandelayo:

Ukuvumelana nezimo okuthuthukisiwe:
Njengoba izinto zezokwelapha ziba ukumelana nokuguga futhi zinethezekile, ukukhulisa ukuguquguquka kwama-PCB aguquguqukayo kunganika amandla ukuhlanganiswa okungenamthungo nalawa madivayisi.Ngokusebenzisa izinto ezintsha nezindlela zokukhiqiza, i-Capel ingakhuphula amandla okugoba ama-PCB aguquguqukayo ngaphandle kokuphazamisa ukusebenza kwawo noma ukwethembeka.
Idizayini yebhodi lesekethe elincane:
Ngaphezu kobukhulu bebhodi lesifunda elincane, ukwehlisa ngokwengeziwe ukushuba kwama-PCB aguquguqukayo kunganikeza izinzuzo ezengeziwe mayelana nokunciphisa isisindo kanye nokuvumelana nezimo.Le ntuthuko izokwenza ukuthi kuthuthukiswe izinsiza zezokwelapha ezincane, ezinethezekile ezigulini.
Ukuhlanganiswa kobuchwepheshe obuphambili:
I-Capel ingasekela ukuthuthukiswa kwemishini yezokwelapha ehlakaniphile ngokuhlanganisa ubuchwepheshe obuthuthukisiwe obufana nokuxhuma okungenantambo, izinzwa namandla okucubungula idatha kuma-PCB aguquguqukayo.Lokhu okusha kwezobuchwepheshe kuzovumela ukuqapha idatha ngesikhathi sangempela, kuthuthukise ulwazi lwesiguli futhi kuthuthukise amakhono okuxilonga.


Isikhathi sokuthumela: Sep-09-2023
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