I-CAPEL FPC & Flex-Rigid PCB Production Amandla
| Umkhiqizo | Ukuminyana Okuphezulu | |||
| I-Interconnect (HDI) | ||||
| I-Standard Flex circuits Flex | Izifunda eziguquguqukayo eziyisicaba | I-Rigid Flex Circuit | Ukushintsha Kwe-Membrane | |
| Usayizi Wephaneli Ejwayelekile | 250mm X400mm | Ifomethi yokugoqa | 250mmX400mm | 250mmX400mm |
| ububanzi bomugqa kanye nesikhala | 0.035mm 0.035mm | 0 .010"(0.24mm) | 0.003"(0.076mm) | 0.10"(.254mm) |
| Ukuqina Kwethusi | 9um/12um/18um/35um/70um/100um/140um | 0.028mm-.01mm | 1/2 oz.nangaphezulu | 0.005"-.0010" |
| Ukubala Kwesendlalelo | 1-32 | 1-2 | 2-32 | 1-2 |
| NGENA / USIZE WOKUDLA | ||||
| I-Drill Minimum (Mechanical) Imbobo Diameter | 0.0004" ( 0.1 mm) 0.006" ( 0.15 mm) | N/A | 0.006" ( 0.15 mm) | 10 mil (0.25 mm) |
| Ubuncane Be-(Laser) Usayizi | 4 mil (0.1mm) 1 mil (0.025 mm) | N/A | 6 mil (0.15 mm) | N/A |
| Ubuncane beMicro Via (Laser) Usayizi | 3 mil (0.076 mm) 1 mil ( 0.025 mm) | N/A | 3 mil (0.076 mm) | N/A |
| I-Stiffener Material | I-Polyimide / FR4 / Metal / SUS / Alu | I-PET | FR-4 / Poyimide | I-PET / Metal/FR-4 |
| Izinto Zokuvikela | Ithusi / isiliva Lnk / Tatsuta / Carbon | I-Silver Foil/Tatsuta | I-Copper / Silver Ink/Tattuta / Carbon | I-Silver Foil |
| Izinto Zokusebenza | 2 mil ( 0.051 mm) 2 mil ( 0.051 mm) | 10 mil (0.25mm) | 2 mil (0.51 mm) | 5 amamilimitha (0.13 mm) |
| I-Zif Tolerance | 2 mil ( .051 mm) 1 mil ( 0.025 mm) | 10 mil (0.25mm) | 2 mil (0.51 mm) | 5 amamilimitha (0.13 mm) |
| SOLDER MASK | ||||
| I-Solder Mask Bridge Phakathi Kwedamu | 5 mil ( .013 mm ) 4 mill (0 .01mm) | N/A | 5 amamilimitha (0.13 mm) | 10 mil (0.25mm) |
| I-Solder Mask Registration Tolerance | 4 mil ( .010 mm) 4 mil( 0.01mm) | N/A | 5 amamilimitha (0.13 mm) | 5 amamilimitha (0.13 mm) |
| I-COVERLAY | ||||
| Ukubhaliswa kwe-Coverlay | 8 mil5 | 10 mil | 8 mil | 10 mil |
| Ukubhaliswa kwe-PIC | 7 mil 4 | N/A | 7 mil | N/A |
| Ukubhaliswa Kwemaski ye-Solder | 5 mil 4 | N/A | 5 mil | 5 mil |
| I-Surface Qeda | I-ENIG/I-Immersion Silver/I-Tin yokucwiliswa/I-Gold Plating/I-Tin Plating/OSP/ ENEPIG | |||
| Inganekwane | ||||
| Ubuncane Ubude | 35 mil 25 mil | 35 mil | 35 mil | Imbondela Yezithombe |
| Ububanzi obuncane | 8 mil 6 | 8 mil | 8 mil | |
| Ubuncane besikhala | 8 mil 6 | 8 mil | 8 mil | |
| Ukubhalisa | ±5mil ±5mil | ±5mil | ±5mil | |
| Impedance | ±10% ±10% | ±20% | ±10% | NA |
| I-SRD ( Steel Rule Die ) | ||||
| Ukubekezelela Uhlaka | 5 mil ( 0.13 mm) 2 mil ( 0.051 mm) | N/A | 5 amamilimitha (0.13 mm) | 5 amamilimitha (0.13 mm) |
| Irediyasi encane | 5 mil (0.13 mm) 4 mil (0.10 mm) | N/A | 5 amamilimitha (0.13 mm) | 5 amamilimitha (0.13 mm) |
| Ngaphakathi Irediyasi | 20 mil ( 0.51 mm) 10 mil ( 0.25 mm) | N/A | 31 mil | 20 mil (0.51 mm) |
| Punch Usayizi Wembobo Encane | 40 mil ( 10.2 mm) 31.5 mil ( 0.80 mm) | N/A | N/A | 40 mil (1.02 mm) |
| Ukubekezelela Usayizi Wembobo Ye-Punch | ± 2mil ( 0.051 mm) ± 1 mil | N/A | N/A | ± 2 mil (0.051 mm) |
| Slot Ububanzi | 20 mil ( 0.51 mm) 15 mil ( 0.38 mm) | N/A | 31 mil | 20 mil (0.51 mm) |
| I-Toleranc yembobo yokuchaza | ± 3 mil ± 2 mil | N/A | ±4 mill | 10 mil |
| Ukubekezelelwa konqenqema lwembobo kuhlaka | ± 4 mil ± 3 mil | N/A | ±5 mill | 10 mil |
| Ubuncane bokulandelela ukuze uhlaka | 8 mil5 | N/A | 10 mil | 10 mil |
I-CAPEL PCB Ikhono Lokukhiqiza
| Imingcele Yezobuchwepheshe | ||
| Cha. | Iphrojekthi | Izinkomba zobuchwepheshe |
| 1 | Isendlalelo | 1-60(ungqimba) |
| 2 | Indawo yokucubungula ephezulu | 545 x 622 mm |
| 3 | Ubuncane bobukhulu | 4(ungqimba)0.40mm |
| 6(ungqimba) 0.60mm | ||
| 8(ungqimba) 0.8mm | ||
| 10(ungqimba)1.0mm | ||
| 4 | Ububanzi bomugqa obuncane | 0.0762mm |
| 5 | Isikhala esincane | 0.0762mm |
| 6 | Imbobo encane yomshini | 0.15mm |
| 7 | Imbobo yodonga lwethusi ukujiya | 0.015mm |
| 8 | Ukubekezelelwa kwe-metalized aperture | ±0.05mm |
| 9 | Ukubekezelela ukungena kwe-metallized | ±0.025mm |
| 10 | Ukubekezelelana kwezimbobo | ±0.05mm |
| 11 | Ukubekezelela Dimensional | ±0.076mm |
| 12 | Ibhuloho elincane le-solder | 0.08mm |
| 13 | Ukumelana ne-insulation | 1E+12Ω (evamile) |
| 14 | Isilinganiso sobukhulu bepuleti | 1:10 |
| 15 | Ukushaqeka okushisayo | 288 ℃ (izikhathi ezi-4 ngemizuzwana eyi-10) |
| 16 | Ihlanekezelwe futhi igobile | ≤0.7% |
| 17 | Amandla okulwa nogesi | ＞1.3KV/mm |
| 18 | Amandla okulwa nokuhlubula | 1.4N/mm |
| 19 | I-Solder imelana nobunzima | ≥6H |
| 20 | Ukuncipha komlilo | 94V-0 |
| 21 | Ukulawulwa kwe-impedance | ±5% |
I-CAPEL PCBA Amandla Okukhiqiza
| Isigaba | Imininingwane | |
| Isikhathi esiholayo | Amahora angama-24 I-Prototyping, isikhathi sokulethwa kwe-batch encane cishe izinsuku ezi-5. | |
| PCBA Amandla | I-SMT patch 2 million points/day, THT 300,000 points/day, 30-80 orders/day. | |
| Isevisi yezingxenye | I-Turnkey | Ngohlelo lokuphathwa kokuthengwa kwempahla oluvuthiwe nolusebenzayo, sisebenzela amaphrojekthi we-PCBA ngokusebenza kwezindleko eziphezulu.Ithimba lonjiniyela bokuthengwa kwempahla abangochwepheshe kanye nabasebenzi bokuthenga abanolwazi banesibopho sokuthenga nokuphatha izingxenye zamakhasimende ethu. |
| Ikhithiwe noma Ithunyelwe | Ngethimba eliqinile lokuphatha ukuthengwa kwempahla kanye nochungechunge lokuhlinzeka ngezingxenye, Amakhasimende asinikeza izingxenye, senza umsebenzi wokuhlanganisa. | |
| Inhlanganisela | Yamukela izingxenye noma izingxenye ezikhethekile zinikezwa amakhasimende.kanye nezinsiza zezingxenye zamakhasimende. | |
| Uhlobo lwe-PCBA Solder | I-SMT, THT, noma i-PCBA soldering services zombili. | |
| I-Solder Paste/Tin Wire/Tin Bar | i-lead and lead-free (i-RoHS ehambisanayo) nezinsizakalo zokucubungula ze-PCBA.Futhi unikeze unamathisele we-solder owenziwe ngezifiso. | |
| I-stencil | i-laser cutting stencil ukuze kuqinisekiswe ukuthi izingxenye ezifana nama-IC anephimbo elincane ne-BGA zihlangabezana ne-IPC-2 Class noma ngaphezulu. | |
| I-MOQ | 1, kodwa seluleka amakhasimende ethu ukuthi akhiqize okungenani amasampula angu-5 ukuze ahlaziye futhi ahlolwe. | |
| Usayizi Wengxenye | • Izingxenye ze-Passive: senza kahle ekufakeni intshi engu-01005 (0.4mm * 0.2mm), 0201 izingxenye ezincane ezinjalo. | |
| • Ama-IC anembe kakhulu njenge-BGA: Singathola izingxenye ze-BGA ezinezikhala ze-Min 0.25mm nge-X-ray. | ||
| Iphakheji Yengxenye | ireli, itheyiphu yokusika, ishubhu, namaphalethi ezingxenye ze-SMT. | |
| Ukunemba Okuphezulu Kwentaba Yezingxenye (100FP) | Ukunemba kungu-0.0375mm. | |
| Uhlobo lwe-PCB oluthengiswayo | I-PCB (FR-4, i-metal substrate), i-FPC, i-Rigid-flex PCB, i-Aluminium PCB, i-HDI PCB. | |
| Isendlalelo | 1-30 (ungqimba) | |
| Indawo yokucubungula ephezulu | 545 x 622 mm | |
| Ubuncane bobukhulu | 4(ungqimba)0.40mm | |
| 6(ungqimba) 0.60mm | ||
| 8(ungqimba) 0.8mm | ||
| 10(ungqimba)1.0mm | ||
| Ububanzi bomugqa obuncane | 0.0762mm | |
| Isikhala esincane | 0.0762mm | |
| Imbobo encane yomshini | 0.15mm | |
| Imbobo yodonga lwethusi ukujiya | 0.015mm | |
| Ukubekezelelwa kwe-metalized aperture | ±0.05mm | |
| Imbobo engeyona eyensimbi | ±0.025mm | |
| Ukubekezelelana kwezimbobo | ±0.05mm | |
| Ukubekezelela Dimensional | ±0.076mm | |
| Ibhuloho elincane le-solder | 0.08mm | |
| Ukumelana ne-insulation | 1E+12Ω (evamile) | |
| Isilinganiso sobukhulu bepuleti | 1:10 | |
| Ukushaqeka okushisayo | 288 ℃ (izikhathi ezi-4 ngemizuzwana eyi-10) | |
| Ihlanekezelwe futhi igobile | ≤0.7% | |
| Amandla okulwa nogesi | ＞1.3KV/mm | |
| Amandla okulwa nokuhlubula | 1.4N/mm | |
| I-Solder imelana nobunzima | ≥6H | |
| Ukuncipha komlilo | 94V-0 | |
| Ukulawulwa kwe-impedance | ±5% | |
| Ifomethi yefayela | I-BOM, PCB Gerber, Khetha nendawo. | |
| Ukuhlola | Ngaphambi kokulethwa, sizosebenzisa izindlela ezahlukahlukene zokuhlola ku-PCBA ekukhweni noma osekuvele kuyi-mount: | |
| • I-IQC: ukuhlolwa okungenayo; | ||
| • IPQC: ukuhlolwa kokukhiqiza, ukuhlolwa kwe-LCR kwesiqephu sokuqala; | ||
| • I-Visual QC: ukuhlolwa kwekhwalithi evamile; | ||
| • I-AOI: umphumela wokudambisa wezingxenye zepheshi, izingxenye ezincane noma i-polarity yezingxenye; | ||
| • I-X-Ray: hlola i-BGA, i-QFN nokunye ukunemba okuphezulu kufihliwe izingxenye ze-PAD; | ||
| • Ukuhlola Okusebenzayo: Umsebenzi wokuhlola nokusebenza ngokuvumelana nezinqubo zokuhlola zekhasimende nezinqubo zokuqinisekisa ukuthotshelwa komthetho. | ||
| Lungisa & Sebenza Kabusha | Isevisi yethu yokulungisa i-BGA ingasusa ngokuphephile indawo engafanele, engekho, kanye ne-BGA engamanga futhi iphinde ixhume ku-PCB ngokuphelele. | |
