Izingxenye eziyinhloko ze-Multilayer FPC PCB

Amabhodi wesekethe aphrintiwe we-Multilayer flexible (FPC PCB) ayizingxenye ezibalulekile ezisetshenziswa ezinhlobonhlobo zezinto zikagesi, kusukela kuma-smartphone namaphilisi kuya emishinini yezokwelapha nezinhlelo zezimoto. Lobu buchwepheshe obuthuthukisiwe bunikeza ukuguquguquka okukhulu, ukuqina kanye nokudluliswa kwesignali okuphumelelayo, okwenza kufuneke kakhulu emhlabeni wedijithali osheshayo wanamuhla.Kulokhu okuthunyelwe kwebhulogi, sizoxoxa ngezinto eziyinhloko ezakha i-FPC ye-multilayer PCB kanye nokubaluleka kwazo ezinhlelweni zikagesi.

1. I-substrate eguqukayo:

I-substrate eguquguqukayo iyisisekelo se-multilayer FPC PCB.Inikeza ukuguquguquka okudingekayo kanye nobuqotho bemishini ukuze umelane nokugoba, ukugoqa nokusonteka ngaphandle kokuphazamisa ukusebenza kwe-elekthronikhi. Imvamisa, izinto ze-polyimide noma i-polyester zisetshenziswa njengesisekelo sesisekelo ngenxa yokuzinza kwazo okuhle kakhulu kokushisa, ukufakwa kukagesi, kanye nekhono lokusingatha ukunyakaza okuguquguqukayo.

2. Isendlalelo esiqhutshwayo:

Izendlalelo ze-conductive ziyizingxenye ezibaluleke kakhulu ze-FPC ye-multilayer ngoba zisiza ukuhamba kwamasignali kagesi kusekethe.Lezi zingqimba ngokuvamile zenziwe ngethusi, eline-conductivity kagesi enhle kakhulu kanye nokumelana nokugqwala. I-foil yethusi i-laminated ku-substrate eguquguqukayo isebenzisa i-adhesive, futhi inqubo yokunamathisela elandelayo iyenziwa ukuze kwakhiwe iphethini yesifunda oyifunayo.

3. Isendlalelo se-insulation:

Izendlalelo ezivikelayo, ezaziwa nangokuthi izendlalelo ze-dielectric, zibekwe phakathi kwezingqimba eziqhutshwayo ukuvimbela izikhindi zikagesi futhi zinikeze ukuhlukaniswa.Zenziwe ngezinto ezahlukahlukene ezifana ne-epoxy, i-polyimide noma imaski ye-solder, futhi zinamandla aphezulu e-dielectric nokuzinza kokushisa. Lezi zendlalelo zidlala indima ebalulekile ekugcineni ubuqotho besignali kanye nokuvimbela ukungqubuzana phakathi kokulandela umkhondo we-conductive oseduze.

4. Imaski ye-solder:

Imaski ye-Solder iyisendlalelo sokuvikela esisetshenziswa ezendlalelo ezibambayo nezivikelayo ezivimbela amasekhethi amafushane ngesikhathi sokusoda futhi ivikele iminonjana yethusi ezicini zemvelo ezifana nothuli, umswakama kanye ne-oxidation.Zivamise ukuba luhlaza ngombala kodwa zingavela nangeminye imibala njengobomvu, oluhlaza okwesibhakabhaka noma omnyama.

5. Imbondela:

I-Coverlay, eyaziwa nangokuthi ifilimu yekhava noma ifilimu yekhava, iyisendlalelo esivikelayo esisetshenziswa endaweni engaphandle ye-FPC PCB enezingqimba eziningi.Inikeza ukufakwa okwengeziwe, ukuvikelwa kwemishini kanye nokumelana nomswakama nokunye ukungcola. Izembozo ngokuvamile zinezikhala zokubeka izingxenye futhi zivumela ukufinyelela okulula kumaphedi.

6. I-Copper Plating:

I-Copper plating iyinqubo yokufaka ungqimba oluncane lwethusi nge-electroplating kungqimba olubambayo.Le nqubo isiza ukuthuthukisa ukusebenza kukagesi, i-impedance ephansi, futhi ithuthukise ubuqotho besakhiwo se-multilayer FPC PCBs. I-Copper plating iphinde yenze kube lula ukulandela umkhondo we-fine-pitch kumasekhethi asondelene kakhulu.

7. Ngezindlela:

I-Via iyimbobo encane ebhobozwe ezendlalelo eziqhutshwayo ze-FPC PCB enezingqimba eziningi, exhuma isendlalelo esisodwa noma ngaphezulu ndawonye.Zivumela ukuxhumana okuqondile futhi zinike amandla umzila wesignali phakathi kwezendlalelo ezihlukene zesekethe. I-Vias ivamise ukugcwaliswa ngethusi noma nge-conductive paste ukuze kuqinisekiswe ukuxhumana okuthembekile kukagesi.

8. Amaphedi ezingxenye:

Amaphedi ezingxenye izindawo eziku-FPC PCB enezingqimba eziningi ezikhethelwe ukuxhuma izingxenye ze-elekthronikhi njengezimelaphi, ama-capacitor, amasekhethi ahlanganisiwe, nezixhumi.Lawa maphedi ngokuvamile enziwe ngethusi futhi axhunywe emithonjeni engaphansi ye-conductive esebenzisa i-solder noma i-adhesive conductive.

Ngokufigqiwe:

Ibhodi lesifunda eliphrintiwe elinezingqimba eziningi (FPC PCB) liyisakhiwo esiyinkimbinkimbi esakhiwe izingxenye ezimbalwa eziyisisekelo.Ama-substrate aguquguqukayo, izendlalelo ze-conductive, izendlalelo ezivikelayo, izifihla-buso, izimbongolo, i-copper plating, i-vias kanye nama-pads ezingxenye zisebenza ndawonye ukuze zinikeze uxhumano oludingekayo lukagesi, ukuguquguquka kwemishini nokuqina okudingekayo emishinini yesimanje kagesi. Ukuqonda lezi zingxenye ezinkulu kusiza ekwakhiweni nasekukhiqizeni ama-FPC PCB asezingeni eliphezulu ahlangabezana nezidingo eziqinile zezimboni ezahlukahlukene.