Isendlalelo se-HDI sesibili esingu-8 - HDI PCB - singcwatshwe imbobo eyimpumputhe i-flex-rigid pcb
Sethula umkhiqizo wethu wakamuva, ungqimba lwesibili lwe-HDI yezinga eliphezulu elingu-8 - HDI PCB - engcwatshwe eyimpumputhe ngebhodi eliguquguqukayo eliqinile.Lesi sixazululo esisha nesithembekile senzelwe ngqo imboni yezimoto zikagesi.
-UCapel uneminyaka engu-15 yesipiliyoni sobuchwepheshe
Sethula umkhiqizo wethu wakamuva, ungqimba lwesibili lwe-HDI yezinga eliphezulu elingu-8 - HDI PCB - engcwatshwe eyimpumputhe ngebhodi eliguquguqukayo eliqinile.Lesi sixazululo esisha nesithembekile senzelwe ngqo imboni yezimoto zikagesi.
Enziwe ngezinto ezifana ne-PI, Copper, Adhesives kanye ne-FR4, ama-PCB ethu akhiwe ukuze ahlangabezane nezidingo ezidingekayo zezinhlelo zokusebenza zezimoto.Ngobukhulu obungu-1.0mm +/- 0.03mm kanye nobubanzi bembobo obuncane obungu-0.1mm, amabhodi ethu e-PCB ahlinzeka ngokuqina nokunemba okudingekayo kuma-electronics wezimoto.
Esinye sezici ezibalulekile zemikhiqizo yethu ukufakwa kwe-vias eyimpumputhe kanye nengcwatshiwe.I-Blind vias (L1-L2, L7-L8) kanye nama-vias angcwatshwe (L2-L3, L4-L5, L6-L7) anika amandla imiklamo eyinkimbinkimbi futhi ehlangene, kuyilapho ukugcwaliswa kwemigodi egcwele kuqinisekisa ubuqotho bokuxhumana ngaphakathi kwe-PCB.
Ukwengeza, ama-PCB ethu alashwa nge-ENIG futhi anogqinsi ongu-2-3uin, ahlinzeka ngokuqeda okuyisivikelo nokuthembekile.Ububanzi bethu bomugqa we-PCB nesikhala ngu-0.1mm/0.1mm, kunikeza ukunemba nokunemba okudingekayo kumishini kagesi yezimoto.
I-High Density HDI Second Order 8 Layer - HDI PCB - Buried Blind Via Soft Rigid PCB yakhelwe ukuhlinzeka ngesisombululo esithembekile sezicelo zemoto kagesi.Njengoba izimoto zikagesi ziqhubeka nokukhula embonini yezimoto, isidingo sezinto ezithuthukile neziqinile ze-elekthronikhi siyakhula.Ama-PCB ethu enzelwe ukuhlangabezana nalezi zidingo, ehlinzeka ngezixazululo ezinokwethenjelwa nezisebenzayo zezicelo zezimoto zikagesi.
Ngokungeziwe ekwakhiweni okumazombezombe, ama-PCB ethu afaka nokubekezelela okungu-±0.1mm, okuqinisekisa ukungaguquguquki nokunemba enqubweni yokukhiqiza.Leli zinga lokunemba libalulekile ekusebenzeni nasekuthembekeni kwezinhlelo ze-elektroniki zezimoto.
Sekukonke, ungqimba lwethu lwesibili lwe-HDI olunezinga eliphezulu elingu-8 - HDI PCB - singcwatshwe impumputhe ngebhodi eliguquguqukayo eliyi-rigid-flex board iyisixazululo esiphambili embonini yezimoto zikagesi.Ngezici zayo ezithuthukisiwe kanye nesakhiwo esihlala isikhathi eside, iyakwazi ukuhlangabezana nezidingo ezishintshayo ze-elekthronikhi yezimoto futhi inikeze izixazululo ezinokwethenjelwa neziphumelelayo zezicelo zemoto kagesi.
I-Capel Flexible PCB & Rigid-Flex PCB Ikhono Lenqubo
| Isigaba | Amandla okucubungula | Isigaba | Amandla okucubungula |
| Uhlobo Lokukhiqiza | I-Single layer FPC / I-Double layers FPC I-Multi-layer FPC / Aluminium PCBs I-Rigid-Flex PCB | Inombolo Yezendlalelo | 1-30Izigaba FPC 2-32izingqimba Rigid-FlexPCB1-60izingqimba I-PCB eqinile HDIAmabhodi |
| Usayizi Wokukhiqiza Omkhulu | Isendlalelo esisodwa se-FPC 4000mm Izendlalelo ezikabili FPC 1200mm I-Multi-layer FPC 750mm I-Rigid-Flex PCB 750mm | I-Insulating Layer Ubukhulu | 27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um/150um |
| Ukuqina Kwebhodi | I-FPC 0.06mm - 0.4mm I-Rigid-Flex PCB 0.25 - 6.0mm | Ukubekezelelwa kwe-PTH Usayizi | ±0.075mm |
| I-Surface Qeda | Ukucwiliswa Igolide/Ukucwiliswa Isiliva/Igolide Plating/Tin Plating/OSP | I-Stiffener | FR4 / PI / PET / SUS / PSA/Alu |
| Usayizi we-Semicircle Orifice | Ubuncane 0.4mm | Isikhala somugqa omncane/ ububanzi | 0.045mm/0.045mm |
| Ukujiya Ukubekezelelana | ±0.03mm | Impedance | 50Ω-120Ω |
| Ukuqina kwe-Copper Foil | 9um/12um/18um/35um/70um/100um | Impedance Kulawulwa Ukubekezelelana | ±10% |
| Ukubekezelelwa kwe-NPTH Usayizi | ±0.05mm | I-Min Flush Width | 0.80mm |
| Min Via Hole | 0.1mm | Sebenzisa Okujwayelekile | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
I-Capel yenza ngokwezifiso ibhodi lesifunda elinembayo eliqinile eliqinile / i-Flexible PCB / HDI PCB enesipiliyoni seminyaka engu-15 ngobungcweti bethu.
I-2 Layer Flexible PCB Boards Stackup
I-4 Layer Rigid-Flex PCB Stackup
8 ungqimba HDI PCBs
Izisetshenziswa zokuhlola nokuhlola
Ukuhlola Isibonakhulu
Ukuhlolwa kwe-AOI
Ukuhlolwa kwe-2D
Ukuhlolwa kwe-Impedans
Ukuhlolwa kwe-RoHS
I-Flying Probe
Umhloli Ovundlile
Ukugoba i-Teste
I-Capel inikeza amakhasimende Isevisi ye-PCB eyenziwe ngezifiso eneminyaka engu-15 yesipiliyoni
- Ubunikazi 3izimboni ze-Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
- 300+Onjiniyela Bahlinzeka ngosekelo lobuchwepheshe ngokuthengisa kwangaphambilini nangemuva kokuthengisa ku-inthanethi;
- 1-30izingqimba FPC,2-32izingqimba ze-Rigid-FlexPCB,1-60izingqimba I-PCB eqinile
- HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminium PCB , I-SMT & PTH Assembly, PCB Prototype Service.
- NikezaAmahora angu-24Isevisi ye-PCB Prototyping, Amaqoqo Amancane amabhodi wesekethe azolethwa ngaphakathiizinsuku 5-7, Ukukhiqizwa Okuningi kwamabhodi e-PCB kuzolethwa ngaphakathi2-3 amasonto;
- Izimboni esizihlinzekayo:Amadivayisi Ezokwelapha, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, njll...
- Amandla ethu Okukhiqiza:
Umthamo wokukhiqiza we-FPC kanye ne-Rigid-Flex PCBs ungafinyelela ngaphezu kwalokho150000sqmngenyanga,
Umthamo wokukhiqiza we-PCB ungafinyelela80000sqmngenyanga,
PCB Ukuhlanganisa umthamo at150,000,000izingxenye ngenyanga.
- Amaqembu ethu onjiniyela nabacwaningi bazinikele ekugcwaliseni izidingo zakho ngokunemba nangobuchwepheshe.
