Ayini ama-micro vias, ama- blind vias kanye nama-vias angcwatshwe kumabhodi we-HDI PCB?

Amabhodi esekethe aphrintiwe we-High-density interconnect (HDI) (PCBs) aguqule imboni yezogesi ngokunika amandla ukuthuthukiswa kwamadivayisi kagesi amancane, alula, nasebenza kahle kakhulu.Ngokuqhubekayo kwe-miniaturization yezingxenye ze-elekthronikhi, izimbobo zendabuko azisanele ukuhlangabezana nezidingo zemiklamo yesimanje. Lokhu kuholele ekusetshenzisweni kwama-microvias, izimpumputhe kanye nama-vias angcwatshwe ku-HDI PCB Board. Kule bhulogi, u-Capel uzobheka ngokujulile lezi zinhlobo zama-vias futhi axoxe ngokubaluleka kwazo ekwakhiweni kwe-HDI PCB.

1. I-Micropore:

Ama-Microholes ayizimbobo ezincane ezinobubanzi obujwayelekile obungu-0.006 kuya ku-0.15 amayintshi (0.15 kuya ku-0.4 mm). Ngokuvamile zisetshenziselwa ukudala ukuxhumana phakathi kwezendlalelo zama-HDI PCB. Ngokungafani nama-vias, adlula kulo lonke ibhodi, ama-microvias adlula kancane ungqimba olungaphezulu. Lokhu kuvumela ukuminyana okuphezulu komzila kanye nokusetshenziswa kahle kwesikhala sebhodi, okubenza babaluleke kakhulu ekwakhiweni kwezinto zikagesi ezihlangene.

Ngenxa yobukhulu bawo obuncane, ama-micropores anezinzuzo eziningana. Okokuqala, zinika amandla umzila wezingxenye ze-pitch-pitch ezifana nama-microprocessors nama-memory chips, ukunciphisa ubude bokulandelela kanye nokuthuthukisa ubuqotho besignali. Ngaphezu kwalokho, ama-microvias asiza ukunciphisa umsindo wesignali futhi athuthukise izici zokudlulisa isignali enesivinini esikhulu ngokunikeza izindlela ezimfushane zesignali. Ziphinde zibe negalelo ekuphathweni okungcono kokushisa, njengoba zivumela i-thermal vias ukuthi ibekwe eduze nezingxenye ezikhiqiza ukushisa.

2. Imbobo eyimpumputhe:

I-Vis eyimpumputhe ifana ne-microvias, kodwa isuka kungqimba yangaphandle ye-PCB iye kungqimba olulodwa noma ngaphezulu yangaphakathi ye-PCB, yeqa ezinye izendlalelo eziphakathi. Lawa ma-vias abizwa ngokuthi "i-blind vias" ngoba abonakala ohlangothini olulodwa lwebhodi. Ama-vias ayimpumputhe asetshenziswa kakhulu ukuxhuma ungqimba lwangaphandle lwe-PCB nesendlalelo sangaphakathi esiseduze. Uma kuqhathaniswa nezimbobo, ingathuthukisa ukuguquguquka kwezintambo futhi inciphise inani lezendlalelo.

Ukusetshenziswa kwe-vias eyimpumputhe kubaluleke kakhulu ekwakhiweni okuminyanisa lapho imingcele yesikhala ibalulekile. Ngokuqeda isidingo sokubhoboza ngembobo, impumputhe ngokusebenzisa amasignali ahlukene kanye nezindiza zamandla, ukuthuthukisa ubuqotho besignali kanye nokunciphisa izinkinga zokuphazanyiswa kwe-electromagnetic (EMI). Aphinde adlale indima ebalulekile ekwehliseni ukujiya sekukonke kwama-HDI PCB, ngaleyo ndlela abe nesandla kuphrofayili emincane yemishini yesimanje kagesi.

3. Umgodi ogqitshiwe:

Ama-vias angcwatshwe, njengoba igama libonisa, ama-vias afihlwe ngokuphelele ngaphakathi kwezingqimba zangaphakathi ze-PCB. Lezi zindlela azidluli kunoma yiziphi izendlalelo zangaphandle futhi ngaleyo ndlela "zingcwatshwe". Avame ukusetshenziswa kumiklamo eyinkimbinkimbi ye-HDI PCB efaka izendlalelo eziningi. Ngokungafani nama-microvias nama-vias ayimpumputhe, ama-vias angcwatshwe awabonakali nhlangothi zombili zebhodi.

Inzuzo enkulu yama-vias angcwatshwe yikhono lokuhlinzeka ngoxhumano ngaphandle kokusebenzisa izendlalelo zangaphandle, okuvumela ukuminyana okuphezulu kwemizila. Ngokukhulula isikhala esibalulekile kwizendlalelo zangaphandle, ama-vias angcwatshwe angakwazi ukuthwala izingxenye ezengeziwe nemikhondo, okuthuthukisa ukusebenza kwe-PCB. Ziphinde zisize ekuthuthukiseni ukuphathwa kokushisa, njengoba ukushisa kungahlakazwa ngokuphumelelayo ngezandlalelo zangaphakathi, kunokuthembela kuphela ku-thermal vias ezingqimbeni zangaphandle.

Ekuphetheni,ama-micro, ama-vias ayimpumputhe kanye nama-vias angcwatshwe yizici ezibalulekile ekwakhiweni kwebhodi le-HDI PCB futhi kunikeza izinzuzo eziningi ezihlukahlukene zokusebenzisa i-miniaturization kanye nezisetshenziswa zikagesi eziminyana kakhulu.Ama-Microvias anika amandla umzila ominyene nokusebenzisa kahle isikhala sebhodi, kuyilapho ama-blind vias ahlinzeka ngokuguquguquka futhi anciphise ukubalwa kwesendlalelo. Indlela yokungcwatshwa iphinde ikhulise ukuminyana kwemizila, ikhulule izendlalelo zangaphandle ukuze kukhuliswe ukubekwa kwengxenye nokuphathwa okushisayo okuthuthukisiwe.

Njengoba imboni yezogesi iqhubeka nokuphusha imingcele ye-miniaturization, ukubaluleka kwalawa ma-vias kumiklamo ye-HDI PCB Board kuzokhula kuphela. Onjiniyela nabaklami kumele baqonde amakhono abo kanye nemikhawulo ukuze bayisebenzise ngempumelelo futhi bakhe izinto zikagesi ezisezingeni eliphezulu ezihlangabezana nezidingo ezihlala zikhula zobuchwepheshe besimanje.I-Shenzhen Capel Technology Co., Ltd ingumkhiqizi onokwethenjelwa nozinikele wamabhodi wesekethe aphrintiwe we-HDI. Ngesipiliyoni seminyaka engu-15 sephrojekthi kanye nokuqamba okusha okuqhubekayo, bayakwazi ukunikeza izixazululo zekhwalithi ephezulu ezihlangabezana nezidingo zamakhasimende. Ukusebenzisa kwabo ulwazi lobuchwepheshe lobuchwepheshe, amakhono enqubo ethuthukisiwe, kanye nemishini yokukhiqiza ethuthukisiwe nemishini yokuhlola kuqinisekisa imikhiqizo ethembekile nengabizi kakhulu. Kungakhathaliseki ukuthi i-prototyping noma ukukhiqizwa ngobuningi, ithimba labo elinolwazi lochwepheshe bebhodi lesifunda lizibophezele ekuletheni izixazululo ze-PCB zobuchwepheshe bezinga lokuqala ze-HDI zanoma iyiphi iphrojekthi.