Thuthukisa ukwakhiwa kwe-PCB yakho: khetha isiphetho esifanele sebhodi lakho elinezendlalelo eziyi-12

Kule bhulogi, sizoxoxa ngezinye izindlela zokwelapha ezidumile kanye nezinzuzo zazo ukuze zikusize uthuthukise inqubo yakho yokwenziwa kwe-PCB enezendlalelo eziyi-12.

Emkhakheni wamasekethe e-elekthronikhi, amabhodi esekethe aphrintiwe (ama-PCB) adlala indima ebalulekile ekuxhumaniseni nasekunikeni amandla izingxenye ezihlukahlukene ze-elekthronikhi. Njengoba ubuchwepheshe buthuthuka, isidingo sama-PCB athuthuke kakhulu nayinkimbinkimbi sikhula kakhulu. Ngakho-ke, ukukhiqizwa kwe-PCB sekube yisinyathelo esibalulekile ekukhiqizeni izinto zikagesi ezisezingeni eliphezulu.

Isici esibalulekile okufanele sicatshangelwe ngesikhathi sokukhiqiza i-PCB ukulungiswa kwendawo.Ukwelashwa okungaphezulu kubhekisela ekuhlanganiseni noma ekuqedeleni okufakwa ku-PCB ukuyivikela ezicini zemvelo nokuthuthukisa ukusebenza kwayo. Kunezinhlobonhlobo zezinketho zokwelapha ezitholakalayo, futhi ukukhetha ukwelashwa okuphelele kwebhodi lakho elinezingqimba eziyi-12 kungaba nomthelela omkhulu ekusebenzeni nokuthembeka kwalo.

I-1.HASL (i-solder yomoya oshisayo):
I-HASL iyindlela yokwelapha engaphezulu esetshenziswa kabanzi ebandakanya ukucwilisa i-PCB ku-solder encibilikisiwe bese usebenzisa ummese womoya oshisayo ukuze ukhiphe i-solder eyeqile. Le ndlela inikeza isisombululo esingabizi kakhulu nge-solderability enhle kakhulu. Nokho, inokulinganiselwa okuthile. I-solder ingase ingasatshalaliswa ngokulinganayo ebusweni, okuholela ekuqedeni okungalingani. Ngaphezu kwalokho, ukuchayeka kwezinga lokushisa eliphezulu phakathi nenqubo kungabangela ukucindezeleka okushisayo ku-PCB, kuthinte ukwethembeka kwayo.

2. I-ENIG (igolide lokucwiliswa kwe-nickel engena-electroless):
I-ENIG iyinketho ethandwayo yokwelashwa okungaphezulu ngenxa yokushisela kwayo okuhle kakhulu nokuba flat. Enqubweni ye-ENIG, ungqimba oluncane lwe-nickel lufakwa endaweni yethusi, lulandelwe ungqimba oluncane lwegolide. Lokhu kwelashwa kuqinisekisa ukumelana okuhle kwe-oxidation futhi kuvimbela ukuwohloka kwendawo yethusi. Ukwengeza, ukusatshalaliswa okufanayo kwegolide endaweni kunikeza indawo eyisicaba futhi ebushelelezi, okuyenza ifaneleke izingxenye zephimbo elihle. Kodwa-ke, i-ENIG ayinconyelwe ukusetshenziswa kwemvamisa ephezulu ngenxa yokulahleka kwesignali okungenzeka okubangelwa ungqimba lwe-nickel barrier.

3. I-OSP (i-organic solderability preservative):
I-OSP iyindlela yokwelapha engaphezulu ehlanganisa ukusebenzisa ungqimba oluncane lwe-organic ngqo endaweni yethusi ngokusabela kwamakhemikhali. I-OSP inikeza isisombululo esingabizi kakhulu futhi esivumelana nemvelo njengoba singadingi izinsimbi ezisindayo. Inikeza indawo eyisicaba futhi ebushelelezi eqinisekisa ukuthi i-solderability enhle kakhulu. Kodwa-ke, izintambo ze-OSP zizwela umswakama futhi zidinga izimo ezifanele zokugcina ukuze zigcine ubuqotho bazo. Amabhodi aphethwe yi-OSP nawo asengozini yokuklwebheka nokubamba umonakalo kunezinye izindlela zokwelapha ezingaphezulu.

4. Isiliva lokucwiliswa:
Isiliva lokucwiliswa, elibuye laziwe ngesiliva lokucwiliswa, liyinketho edumile yama-PCB anemvamisa ephezulu ngenxa yokuqhuba kahle kwawo kanye nokulahlekelwa kokufakwa okuphansi. Inikeza indawo eyisicaba, ebushelelezi eqinisekisa ukuthengiswa okuthembekile. Isiliva lokucwiliswa lizuzisa kakhulu kuma-PCB anezingxenye zephimbo elihle nezinhlelo zokusebenza ezinesivinini esikhulu. Kodwa-ke, izindawo ezisiliva zivame ukonakala ezindaweni ezinomswakama futhi zidinga ukuphathwa nokugcinwa okufanele ukuze zigcine ubuqotho bazo.

5. Ukufakwa kwegolide eliqinile:
Ukufakwa kwegolide eliqinile kuhlanganisa ukufaka ungqimba oluwugqinsi lwegolide endaweni yethusi ngenqubo ye-electroplating. Lokhu kwelashwa okungaphezulu kuqinisekisa ukuqhutshwa kahle kukagesi kanye nokumelana nokugqwala, okuyenza ifaneleke izinhlelo zokusebenza ezidinga ukufakwa ngokuphindaphindiwe nokususwa kwezingxenye. I-hard gold plating ivamise ukusetshenziswa kuzixhumi ezinqenqemeni namaswishi. Nokho, izindleko zalokhu kwelashwa ziphakeme uma kuqhathaniswa nezinye izindlela zokwelapha ezingaphezulu.

Ngokufigqiwe, ukukhetha ubuso obuphelele obuphelele be-PCB enezingqimba eziyi-12 kubalulekile ekusebenzeni kwayo nasekuthembekeni kwayo.Inketho ngayinye yokwelashwa kwendawo inezinzuzo zayo kanye nemikhawulo, futhi ukukhetha kuncike ezidingweni zakho zohlelo lokusebenza kanye nesabelomali. Ukuthi ukhetha ithini lokufutha elingabizi kakhulu, igolide lokucwiliswa elithembekile, i-OSP enobungani bemvelo, isiliva lokucwiliswa kwemvamisa ephezulu, noma ucwecwe oluqinile lwegolide, ukuqonda izinzuzo nokucatshangelwa kokwelashwa ngakunye kuzokusiza uthuthukise inqubo yakho yokukhiqiza i-PCB futhi uqinisekise impumelelo izinto zakho zikagesi.