I-SMT solder bridging inselele evamile abakhiqizi bezinto zikagesi ababhekana nazo phakathi nenqubo yokuhlanganisa. Lesi senzakalo senzeka lapho i-solder ixhuma ngokungafanele izingxenye ezimbili eziseduze noma izindawo eziqhutshwayo, okuholela kumjikelezo omfushane noma ukusebenza okubi.Kulesi sihloko, sizohlola ubunkimbinkimbi bamabhuloho e-SMT, okuhlanganisa izimbangela zawo, izinyathelo zokuvimbela, nezisombululo ezisebenzayo.
1.Iyini i-SMT PCB Solder Bridging:
Ibhuloho le-SMT elikwaziwa nangokuthi “ibhuloho elifushane le-solder” noma “ibhuloho le-solder,” kwenzeka ngesikhathi kuhlanganiswa izingxenye ze-surface mount technology (SMT) ebhodini lesekethe eliphrintiwe (PCB). Ku-SMT, izingxenye zigxunyekwa ngqo endaweni ye-PCB, futhi i-solder paste isetshenziselwa ukudala ukuxhumana kukagesi nokomshini phakathi kwengxenye ne-PCB. Ngesikhathi senqubo yokuhlanganisa, ukunamathisela kwe-solder kusetshenziswa kumaphedi e-PCB kanye nemikhondo yezingxenye ze-SMT. I-PCB ibe isishisisiwe, okwenza ukuthi ukunamathisela kwe-solder kuncibilike futhi kugeleze, kudala isibopho phakathi kwengxenye ne-PCB.
2.Izimbangela ze-SMT PCB Solder Bridging:
I-SMT solder bridging kwenzeka lapho kwakhiwa ukuxhumana okungahlosiwe phakathi kwamaphedi aseduze noma okuholela ebhodini lesifunda eliphrintiwe (PCB) ngesikhathi somhlangano. Lesi simo singaholela kumasekhethi amafushane, ukuxhumana okungalungile kanye nokwehluleka okuphelele kwemishini kagesi.
Amabhuloho e-SMT angenzeka ngenxa yezizathu ezihlukahlukene, okuhlanganisa ivolumu yokunamathisela ye-solder enganele, idizayini ye-stencil engalungile noma engalungile, ukugeleza okuhlangene kwe-solder okunganele, ukungcoliswa kwe-PCB, kanye nezinsalela ze-flux ngokweqile.Inani elinganele lokunamathisela kwe-solder kungenye yezimbangela zamabhuloho e-solder. Phakathi nenqubo yokuphrinta ye-stencil, ukunamathisela kwe-solder kusetshenziswa kumaphedi e-PCB kanye nomkhondo wengxenye. Uma ungasebenzisi ukunamathisela kwe-solder okwanele, ungagcina unobude obuphansi bokumisa, okusho ukuthi ngeke sibe nendawo eyanele yokunamathisela kwe-solder ukuxhuma kahle ingxenye kuphedi. Lokhu kungaholela ekuhlukaniseni okungalungile kwengxenye kanye nokwakhiwa kwamabhuloho e-solder phakathi kwezingxenye eziseduze. Idizayini ye-stencil engalungile noma ukungaqondani kahle nakho kungabangela ibhuloho le-solder.
Ama-stencil aklanywe ngendlela engafanele angabangela ukufakwa kokunamathisela kwe-solder okungalingani ngesikhathi sokufaka isicelo sokunamathisela i-solder. Lokhu kusho ukuthi kungase kube nokunamathisela kwe-solder okuningi kakhulu kwezinye izindawo futhi kuncane kakhulu kwezinye izindawo.Ukufakwa kwe-solder nokunamathisela okungalinganiselwe kungabangela ukuhlanganisa i-solder phakathi kwezingxenye eziseduze noma izindawo eziqhutshwayo ku-PCB. Ngokufanayo, uma i-stencil ingaqondani kahle ngesikhathi sokufaka isicelo sokunamathisela i-solder, ingabangela ukuthi amadiphozithi e-solder angahambi kahle futhi enze amabhuloho e-solder.
Ukugeleza kabusha kwejoyinti le-solder okunganele kungenye imbangela yebhuloho le-solder. Phakathi nenqubo yokuhlanganisa, i-PCB ene-solder paste ishisiswe ekushiseni okukhethekile ukuze unamathisele we-solder uncibilike futhi ugeleze ukuze wenze amalunga e-solder.Uma iphrofayili yezinga lokushisa noma izilungiselelo zokugeleza kabusha zingasethwanga kahle, i-solder paste ingase ingancibiliki ngokuphelele noma igeleze kahle. Lokhu kungaholela ekuncibilikeni okungaphelele kanye nokuhlukana okunganele phakathi kwamaphedi aseduze noma imikhondo, okuholela ekuhlanganisweni kwe-solder.
Ukungcoliswa kwe-PCB kuyimbangela evamile yokuhlanganisa i-solder. Ngaphambi kwenqubo ye-soldering, ukungcola okunjengothuli, umswakama, uwoyela, noma izinsalela ze-flux kungase kube khona endaweni ye-PCB.Lokhu kungcola kungaphazamisa ukumanzisa okufanele nokugeleza kwe-solder, okwenza kube lula ukuthi i-solder yakhe ukuxhumana okungahlosiwe phakathi kwamaphedi aseduze noma umkhondo.
Izinsalela ze-flux ezeqile nazo zingabangela ukuba amabhuloho e-solder akheke. I-Flux ikhemikhali esetshenziselwa ukususa ama-oxide ezindaweni zensimbi futhi ikhuthaze ukumanzisa nge-solder ngesikhathi sokusoda.Kodwa-ke, uma i-flux ingahlanzwa ngokwanele ngemva kokuhlanganisa, ingase ishiye insalela. Lezi zinsalela zingasebenza njenge-conductive medium, okuvumela i-solder ukuthi idale ukuxhumana okungahlosiwe namabhuloho athengisa phakathi kwamaphedi aseduze noma imikhondo ku-PCB.
3. Izinyathelo zokuvimbela zamabhuloho e-SMT PCB:
A. Lungiselela ukuklama nokuqondanisa kwe-stencil: Enye yezinto ezibalulekile ekuvimbeleni amabhuloho e-solder ukuthuthukisa ukwakheka kwe-stencil kanye nokuqinisekisa ukuqondana okufanele ngesikhathi sokufakwa kwe-solder paste.Lokhu kuhilela ukunciphisa usayizi wokuvula ukuze ulawule inani le-solder paste efakwe kumaphedi e-PCB. Amasayizi amancane we-pore asiza ukunciphisa amathuba okusatshalaliswa kwe-solder ngokweqile nokudangala ibhuloho. Ukwengeza, ukuzungeza unqenqema lwezimbobo ze-stencil kungakhuthaza ukukhululwa okungcono kwe-solder paste futhi kunciphise ukuthambekela kwe-solder ukuhlanganisa phakathi kwamaphedi aseduze. Ukusebenzisa amasu okulwa nokuvala ibhuloho, njengokufaka amabhuloho amancane noma izikhala ekwakhiweni kwe-stencil, kungasiza futhi ukuvimbela ukubhula nge-solder. Lezi zici zokuvimbela ibhuloho zakha umgoqo ongokomzimba ovimbela ukugeleza kwe-solder phakathi kwamaphedi aseduze, ngaleyo ndlela kuncishiswe ithuba lokwakhiwa kwebhuloho le-solder. Ukuqondanisa okufanele kwesifanekiso ngesikhathi sokunamathisela kubalulekile ekugcineni isikhala esidingekayo phakathi kwezingxenye. Ukungalungi kahle kuholela ekufakweni kokunamathisela kwe-solder okungalingani, okwandisa ingozi yamabhuloho e-solder. Ukusebenzisa isistimu yokuqondanisa efana nesistimu yombono noma ukuqondanisa kwe-laser kungaqinisekisa ukubekwa kwe-stencil okunembile futhi kunciphise ukuvela kwebhuloho le-solder.
B. Lawula inani lokunamathisela kwe-solder: Ukulawula inani le-solder paste kubalulekile ukuvimbela ukufakwa ngokweqile, okungaholela ekuhlanganiseni kwe-solder.Kunezici eziningana okufanele zicatshangelwe lapho kunqunywa inani elifanele le-solder unama. Lokhu kufaka phakathi iphimbo, ubukhulu be-stencil, nosayizi wephedi. Ukuhlukaniswa kwezingxenye kudlala indima ebalulekile ekunqumeni inani elanele lokunamathisela kwe-solder edingekayo. Lapho izingxenye zisondelana, kudingeka unamathisele kancane ukuze ugweme ukuhlanganisa ibhuloho. Ukuqina kwe-stencil nakho kuthinta inani le-solder paste efakiwe. Ama-stencil aminyene athambekele ekufakeni unamathisele we-solder, kuyilapho ama-stencil azacile evame ukufaka unamathisele omncane we-solder. Ukulungisa ukujiya kwe-stencil ngokwezidingo ezithile zomhlangano we-PCB kungasiza ukulawula inani le-solder paste elisetshenzisiwe. Ubukhulu bamaphedi ku-PCB kufanele futhi bucatshangelwe lapho kunqunywa inani elifanele lokunamathisela kwe-solder. Amaphedi amakhulu angase adinge ivolumu yokunamathisela ye-solder eyengeziwe, kuyilapho amaphedi amancane angase adinge ivolumu yokunamathisela ye-solder encane. Ukuhlaziya kahle lezi ziguquguqukayo kanye nokulungisa ivolumu yokunamathisela ye-solder ngokufanele kungasiza ekuvimbeleni ukufakwa kwe-solder ngokweqile futhi kunciphise ubungozi bokuhlanganisa i-solder.
C. Qinisekisa ukugeleza kabusha okuhlangene kwe-solder: Ukufeza ukugeleza okuhlangene kwe-solder okufanelekile kubalulekile ekuvimbeleni amabhuloho e-solder.Lokhu kuhilela ukusebenzisa amaphrofayli afanele wezinga lokushisa, izikhathi zokuhlala, nezilungiselelo zokugeleza kabusha phakathi nenqubo yokudayiswa. Iphrofayili yezinga lokushisa isho imijikelezo yokushisisa neyokupholisa i-PCB ehamba kuyo ngesikhathi sokugeleza kabusha. Iphrofayili yezinga lokushisa enconywayo yokunamathisela kwe-solder ethile esetshenzisiwe kufanele ilandelwe. Lokhu kuqinisekisa ukuncibilika okuphelele nokugeleza kokunamathisela kwe-solder, okuvumela ukumanziswa okufanele kwengxenye yokuhola kanye namaphedi e-PCB ngenkathi kuvimbela ukugeleza kabusha okunganele noma okungaphelele. Isikhathi sokuhlala, esisho isikhathi i-PCB evezwa ngaso izinga lokushisa eliphakeme lokugeleza kabusha, kufanele futhi sicatshangelwe ngokucophelela. Isikhathi esanele sokuhlala sivumela ukunamathisela kwe-solder ukuthi kuncibilike ngokuphelele futhi kwakhiwe izinhlanganisela ezidingekayo ze-intermetallic, ngaleyo ndlela kuthuthukise ikhwalithi ye-solder joint. Isikhathi sokuhlala esinganele sibangela ukuncibilika okwanele, okuholela ekuhlanganiseni okungaphelele kwe-solder kanye nokwanda kwengozi yamabhuloho e-solder. Izilungiselelo zokugeleza kabusha, njengesivinini sokuthutha kanye nezinga lokushisa eliphakeme, kufanele zithuthukiswe ukuze kuqinisekiswe ukuncibilika okuphelele nokuqiniswa kwe-solder paste. Kubalulekile ukulawula isivinini sokuthutha ukuze kuzuzwe ukudluliswa kokushisa okwanele kanye nesikhathi esanele sokuthi unamathisele we-solder ugeleze futhi uqine. Izinga lokushisa eliphakeme kufanele limiswe libe sezingeni elifanele lokunamathisela kwe-solder ethile, kuqinisekiswe ukugeleza kabusha okuphelele ngaphandle kokubangela ukubekwa kwe-solder ngokweqile noma ibhuloho.
D. Phatha ukuhlanzeka kwe-PCB: Ukuphatha kahle ukuhlanzeka kwe-PCB kubalulekile ekuvimbeleni ukuhlanganisa i-solder.Ukungcola endaweni ye-PCB kungaphazamisa ukumanzisa kwe-solder futhi kwandise amathuba okwakheka kwebhuloho le-solder. Ukuqeda ukungcola ngaphambi kwenqubo yokushisela kubalulekile. Ukuhlanza ngokuphelele ama-PCB usebenzisa ama-agent okuhlanza afanelekile namasu kuzosiza ukususa uthuli, umswakama, uwoyela, nokunye ukungcola. Lokhu kuqinisekisa ukuthi i-solder paste imanzisa kahle ama-pads e-PCB kanye nomkhondo wengxenye, kunciphisa amathuba okuba namabhuloho e-solder. Ukwengeza, ukugcinwa okufanele nokuphathwa kwama-PCB, kanye nokunciphisa ukuthintana kwabantu, kungasiza ukunciphisa ukungcola nokugcina yonke inqubo yokuhlanganisa ihlanzekile.
E. Ukuhlolwa Kwangemva Kokuthengiswa Nokusetshenzwa Kabusha: Ukwenza ukuhlola okujulile kokubukwayo kanye nokuhlola okuzenzakalelayo kwe-optical inspection (AOI) ngemva kwenqubo yokudayiswa kubalulekile ekuhlonzeni noma yiziphi izinkinga zokuhlanganisa amabhuloho.Ukutholwa ngokushesha kwamabhuloho e-solder kuvumela ukusebenza kabusha okufika ngesikhathi kanye nokulungiswa ukulungisa inkinga ngaphambi kokubangela ezinye izinkinga noma ukwehluleka. Ukuhlola okubukwayo kuhilela ukuhlolwa okuphelele kwamalunga e-solder ukuze kutholakale noma yiziphi izimpawu ze-solder bridging. Amathuluzi okukhulisa, njengesibonakhulu noma i-loupe, angasiza ukukhomba ngokunembile ubukhona bebhuloho lamazinyo. Amasistimu e-AOI asebenzisa ubuchwepheshe bokuhlola obusekelwe ezithombeni ukuze kutholwe ngokuzenzakalelayo futhi kuhlonzwe amaphutha ebhuloho elithengiswayo. Lezi zinhlelo zingaskena ngokushesha ama-PCB futhi zinikeze ukuhlaziya okuningiliziwe kwekhwalithi ehlangene ye-solder, okuhlanganisa ukuba khona kwebhuloho. Amasistimu e-AOI awusizo ikakhulukazi ekutholeni amabhuloho amancane, okunzima ukuwathola angase aphuthelwe ngesikhathi sokuhlolwa okubonakalayo. Uma ibhuloho le-solder selitholakele, kufanele liphinde lisetshenziswe futhi lilungiswe ngokushesha. Lokhu kuhilela ukusebenzisa amathuluzi afanele nezindlela zokususa i-solder eyeqile futhi uhlukanise ukuxhumana kwebhuloho. Ukuthatha izinyathelo ezidingekayo ukuze ulungise amabhuloho e-solder kubalulekile ukuvimbela izinkinga ezengeziwe nokuqinisekisa ukwethembeka komkhiqizo ophelile.
4. Izixazululo Ezisebenzayo Ze-SMT PCB Solder Bridging:
A. Ukuchithwa kwe-manual: Kumabhuloho amancane e-solder, ukukhishwa kwe-solder okwenziwa ngesandla kuyisixazululo esisebenzayo, kusetshenziswa insimbi enethiphu elihle ngaphansi kwengilazi yokukhulisa ukufinyelela nokukhipha ibhuloho le-solder.Lobu buchwepheshe budinga ukuphathwa ngokucophelela ukuze kugwenywe ukulimala ezingxenyeni ezizungezile noma izindawo zokuqhuba. Ukuze ususe amabhuloho e-solder, ukushisa ithiphu lensimbi ye-solder futhi uyisebenzise ngokucophelela ku-solder ngokweqile, uyincibilikise futhi uyisuse endleleni. Kubalulekile ukuqinisekisa ukuthi ichopho le-soldering iron alihlangani nezinye izingxenye noma izindawo ukugwema ukudala umonakalo. Le ndlela isebenza kangcono lapho ibhuloho le-solder libonakala futhi lifinyeleleka, futhi kufanele kuthathwe ukunakekelwa ukuze kwenziwe ukunyakaza okuqondile nokulawulwayo.
B. Sebenzisa i-soldering iron kanye ne-solder wire ukuze usebenze kabusha: Sebenza kabusha usebenzisa i-soldering iron kanye ne-solder wire (eyaziwa nangokuthi i-desoldering braid) kungenye isixazululo esisebenzayo sokususa amabhuloho e-solder.Intambo ye-solder yenziwe ngocingo oluncane lwethusi olugcotshwe nge-flux ukuze lusize enqubweni yokuchithwa. Ukuze usebenzise le nqubo, i-solder wick ibekwe phezu kwe-solder ngokweqile futhi ukushisa kwensimbi ye-solder kufakwa ku-wick ye-solder. Ukushisa kuncibilikisa i-solder futhi intambo imunca i-solder encibilikisiwe, ngaleyo ndlela iyisuse. Le ndlela idinga ikhono nokunemba ukugwema ukulimaza izingxenye ezibucayi, futhi umuntu kufanele aqinisekise ukumbozwa okwanele kwe-solder core ebhulohweni le-solder. Le nqubo ingase idinge ukuphindaphindiwe izikhathi eziningana ukuze isuse ngokuphelele i-solder.
C. Ukutholwa nokususwa kwebhuloho elithengiswayo ngokuzenzakalelayo: Amasistimu okuhlola athuthukile afakwe ubuchwepheshe bokubona komshini angakwazi ukubona ngokushesha amabhuloho athengiswayo futhi enze kube lula ukususwa kwawo ngokushisisa ngelaser yendawo noma ubuchwepheshe bejethi lomoya.Lezi zixazululo ezizenzakalelayo zinikeza ukunemba okuphezulu nokusebenza kahle ekutholeni nasekususeni amabhuloho e-solder. Amasistimu okubona komshini asebenzisa amakhamera nama-algorithms okucubungula izithombe ukuze ahlaziye ikhwalithi ehlanganyelwe ye-solder futhi athole noma yikuphi okudidayo, okuhlanganisa namabhuloho e-solder. Uma isikhonjiwe, isistimu ingaqalisa izindlela zokungenela ezihlukene. Enye indlela enjalo ukushisisa nge-laser yendawo, lapho i-laser isetshenziselwa ukushisa okukhethiwe nokuncibilikisa ibhuloho le-solder ukuze lisuswe kalula. Enye indlela ihilela ukusebenzisa indiza yomoya egxilile esebenzisa ukugeleza komoya okulawulwayo ukuze kukhishwe i-solder ngokweqile ngaphandle kokuthinta izingxenye ezizungezile. Lezi zinhlelo ezizenzakalelayo zonga isikhathi nomzamo ngenkathi ziqinisekisa imiphumela engaguquki nethembekile.
D. Sebenzisa i-wave soldering ekhethiwe: I-selective wave soldering iyindlela yokuvimbela enciphisa ingozi yamabhuloho e-solder ngesikhathi sokudayiswa.Ngokungafani ne-wave soldering evamile, ecwilisa yonke i-PCB ku-wave of solder encibilikisiwe, ukukhetha kwe-wave soldering kusebenza kuphela i-solder encibilikisiwe ezindaweni ezithile, ukudlula kalula izingxenye zokuvala amabhuloho noma izindawo eziqhutshwayo. Lobu buchwepheshe bufinyelelwa ngokusebenzisa i-nozzle elawulwa ngokunembile noma i-wave ye-welding ehambayo eqondise indawo yokushisela oyifunayo. Ngokukhetha ukusebenzisa i-solder, ubungozi bokusabalala kwe-solder ngokweqile kanye nebhuloho kungancishiswa kakhulu. I-selective wave soldering isebenza ikakhulukazi kuma-PCB anezakhiwo eziyinkimbinkimbi noma izingxenye eziminyana kakhulu lapho ubungozi bokubhujwa kwe-solder buphezulu. Inikeza ukulawula okukhulu nokunemba ngesikhathi senqubo yokushisela, ukunciphisa ithuba lokuvela kwamabhuloho e-solder.
Ngokufigqiwe, I-SMT solder bridgeging inselele enkulu engaba nomthelela enqubweni yokukhiqiza kanye nekhwalithi yomkhiqizo ekukhiqizeni izinto zikagesi. Kodwa-ke, ngokuqonda izimbangela nokuthatha izinyathelo zokuvimbela, abakhiqizi banganciphisa kakhulu ukuvela kwe-solder bridging. Ukuthuthukisa ukwakheka kwe-stencil kubalulekile njengoba kuqinisekisa ukubekwa kwe-solder nokunamathisela okufanele futhi kunciphisa ithuba lokunamathisela kwe-solder ngokweqile okubangela ibhuloho. Ukwengeza, ukulawula ivolumu yokunamathisela kwe-solder kanye nemingcele yokugeleza kabusha njengezinga lokushisa nesikhathi kungasiza ekufinyeleleni ukwakheka okuhlangene kwe-solder nokuvimbela ukubhuloho. Ukugcina indawo ye-PCB ihlanzekile kubalulekile ekuvimbeleni ukuhlanganisa i-solder, ngakho-ke kubalulekile ukuqinisekisa ukuhlanzwa okufanele nokususwa kwanoma yikuphi ukungcola noma izinsalela ebhodini. Izinqubo zokuhlola ngemva kokushisela, njengokuhlola okubukwayo noma amasistimu azenzakalelayo, zingathola ukuba khona kwanoma yimaphi amabhuloho e-solder futhi zenze kube lula ukusebenza kabusha ngesikhathi ukuze kuxazululwe lezi zinkinga. Ngokusebenzisa lezi zinyathelo zokuvimbela kanye nokuthuthukisa izixazululo ezisebenzayo, abakhiqizi bezinto zikagesi banganciphisa ubungozi be-SMT solder bridging futhi baqinisekise ukukhiqizwa kwamadivayisi kagesi athembekile, aphezulu. Uhlelo oluqinile lokulawula ikhwalithi kanye nemizamo yokuthuthukisa eqhubekayo nakho kubalulekile ukuze kuqashwe futhi kuxazululwe noma yiziphi izinkinga eziphindelelayo zokuhlanganisa amabhuloho. Ngokuthatha izinyathelo ezifanele, abakhiqizi bangakhuphula ukusebenza kahle kokukhiqiza, banciphise izindleko ezihlobene nokusebenza kabusha nokulungisa, futhi ekugcineni balethe imikhiqizo ehlangabezana noma edlula lokho okulindelwe ngamakhasimende.
Isikhathi sokuthumela: Sep-11-2023
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