Kodwa ingabe wake wazibuza ukuthi lawa mabhodi esifunda se-ceramic enziwa kanjani? Yiziphi izinyathelo ezihilelekile ohlelweni lwabo lokukhiqiza? Kulokhu okuthunyelwe kwebhulogi, sizongena sijule emhlabeni oyinkimbinkimbi wokukhiqiza ibhodi lesifunda se-ceramic, sihlola zonke izinyathelo ezihilelekile ekudalweni kwakho.
Umhlaba wezinto zikagesi ulokhu ushintshashintsha, kanjalo nezinto ezisetshenziswayo ukwenza izinto zikagesi. Amabhodi esekethe e-Ceramic, aziwa nangokuthi ama-PCB e-ceramic, athole ukuduma eminyakeni yamuva nje ngenxa ye-thermal conductivity enhle kakhulu kanye nezakhiwo zokufakwa kukagesi. Lawa mabhodi anikeza izinzuzo eziningi ngaphezu kwamabhodi esekethe aphrintiwe endabuko (ama-PCB), awenze alungele izinhlelo zokusebenza ezihlukahlukene lapho ukuchithwa okushisayo nokuthembeka kubaluleke kakhulu.
Isinyathelo 1: Idizayini kanye ne-Prototype
Isinyathelo sokuqala senqubo yokukhiqiza ibhodi lesifunda se-ceramic siqala ngokuklama kanye ne-prototyping yebhodi lesifunda. Lokhu kuhilela ukusebenzisa isofthiwe ekhethekile ukwakha uhlelo nokunquma ukwakheka nokubekwa kwezingxenye. Uma umklamo wokuqala usuqediwe, ama-prototypes ayathuthukiswa ukuze kuhlolwe ukusebenza nokusebenza kwebhodi ngaphambi kokungena esigabeni sokukhiqiza ivolumu.
Isinyathelo sesi-2: Ukulungiselela izinto ezibonakalayo
Lapho i-prototype isivunyiwe, izinto zokwakha ze-ceramic zidinga ukulungiswa. Amabhodi wesifunda se-Ceramic ngokuvamile enziwe nge-aluminium oxide (i-aluminium oxide) noma i-aluminium nitride (AlN). Izinto ezikhethiwe zigaywe futhi zixutshwe nezithasiselo ukuze kuthuthukiswe izakhiwo zazo, njenge-thermal conductivity namandla emishini. Le ngxube ibe isicindezelwa emashidini noma amateyipu aluhlaza, ilungele ukusetshenzwa okwengeziwe.
Isinyathelo sesi-3: Ukwakhiwa Kwe-Substrate
Phakathi nalesi sinyathelo, itheyiphu eluhlaza noma ishidi libhekana nenqubo ebizwa ngokuthi i-substrate formation. Lokhu kuhilela ukomisa impahla ye-ceramic ukususa umswakama bese uyisika ibe yisimo nosayizi oyifunayo. Imishini ye-CNC (ikhompyutha yokulawula izinombolo) noma izinqamuli ze-laser zivame ukusetshenziselwa ukufeza ubukhulu obunembile.
Isinyathelo sesi-4: Ukwenza Iphethini yesiyingi
Ngemuva kokuthi i-substrate ye-ceramic yakhiwe, isinyathelo esilandelayo i-circuit patterning. Yilapho ungqimba oluncane lwempahla eqhubayo, njengethusi, lufakwa phezu kwe-substrate kusetshenziswa amasu ahlukahlukene. Indlela ejwayeleke kakhulu ukuphrinta kwesikrini, lapho isifanekiso esinephethini yesekethe efiselekayo sibekwe phezu kwe-substrate bese u-inki we-conductive uphoqwa ngesifanekiso phezulu.
Isinyathelo sesi-5: Ukucula
Ngemva kokwakhiwa kwephethini yesifunda, ibhodi lesifunda se-ceramic libhekana nenqubo ebalulekile ebizwa ngokuthi i-sintering. I-Sintering ihilela ukushisa amapuleti emazingeni okushisa aphezulu endaweni elawulwayo, ngokuvamile kuhhavini. Le nqubo ihlanganisa izinto ze-ceramic kanye nemikhondo yokuhambisa ndawonye ukuze kwakhiwe ibhodi lesifunda eliqinile neliqinile.
Isinyathelo sesi-6: I-Metallization ne-Plating
Uma ibhodi seligxiliwe, isinyathelo esilandelayo yi-metallization. Lokhu kuhilela ukufaka ungqimba oluncane lwensimbi, njenge-nickel noma igolide, phezu kwemikhondo yethusi eveziwe. I-Metallization isebenza ngezinhloso ezimbili - ivikela ithusi kusuka ku-oxidation futhi inikeza indawo engcono ethengiswayo.
Ngemuva kwe-metallization, ibhodi lingase libhekane nezinqubo ezengeziwe zokucwenga. I-Electroplating ingathuthukisa izakhiwo noma imisebenzi ethile, njengokuhlinzeka ngokuphela kwendawo ethengiswayo noma ukwengeza okokuvikela.
Isinyathelo sesi-7: Hlola futhi Uhlole
Ukulawulwa kwekhwalithi kuyisici esibalulekile sanoma iyiphi inqubo yokukhiqiza, futhi ukukhiqizwa kwebhodi lesifunda se-ceramic nakho. Ngemva kokwakhiwa kwebhodi lesifunda, kufanele lihlolwe ngokuqinile futhi lihlolwe. Lokhu kuqinisekisa ukuthi ibhodi ngalinye lihlangabezana nezicaciso ezidingekayo namazinga, okuhlanganisa ukuhlola ukuqhubeka, ukumelana nokufakwa kwe-insulation kanye nanoma yiziphi izinkinga ezingaba khona.
Isinyathelo sesi-8: Ukuhlanganisa nokupakisha
Uma ibhodi seliphumelele izigaba zokuhlola nokuhlola, selilungele ukuhlanganiswa. Sebenzisa okokusebenza okuzenzakalelayo ezingxenyeni ze-solder ezifana nama-resistors, ama-capacitor, nama-circuits ahlanganisiwe kumabhodi wesekethe. Ngemva kokuhlanganiswa, amabhodi esekethe ngokuvamile apakishwa ezikhwameni noma kumaphalethi aphikisayo, alungele ukuthunyelwa lapho aya khona.
Ngokufigqiwe
Inqubo yokukhiqiza ibhodi lesifunda se-ceramic ihlanganisa izinyathelo ezimbalwa ezibalulekile, kusukela ekuklanyeni nasekufanekiseni ukuya ekubunjweni kwe-substrate, i-circuit patterning, i-sintering, i-metallization, nokuhlola. Isinyathelo ngasinye sidinga ukunemba, ubungcweti nokunaka imininingwane ukuze kuqinisekiswe ukuthi umkhiqizo wokugcina uhlangabezana nokucaciswa okudingekayo. Izakhiwo eziyingqayizivele zamabhodi wesifunda se-ceramic zenza kube yisinqumo sokuqala ezimbonini ezihlukahlukene, kuhlanganise ne-aerospace, izimoto kanye nezokuxhumana ngocingo, lapho ukwethembeka nokuphathwa kokushisa kubaluleke kakhulu.
Isikhathi sokuthumela: Sep-25-2023
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