I-Delamination iyinkinga ebalulekile emkhakheni wamabhodi esekethe aphrintiwe aqinile (ama-PCB). Isho ukuhlukaniswa noma ukuhlukaniswa kwezingqimba ngaphakathi kwe-PCB, okungaba nomthelela omubi ekusebenzeni kwayo nokuthembeka. I-Delamination ingabangelwa izici ezihlukahlukene, okuhlanganisa izinkinga phakathi nokukhiqizwa kwe-PCB, amasu okuhlanganisa angalungile, nokuphatha okungalungile kwe-PCB.
Kulesi sihloko, umgomo wethu uwukujula ngezizathu ezibangela ukususwa kwamabhodi aqinile-flex futhi sihlole amasu asebenzayo okuvimbela le nkinga. Ngokuqonda umsuka kanye nokuthatha izinyathelo ezifanele zokuvimbela, abakhiqizi nabasebenzisi bangathuthukisa ukusebenza kwe-PCB futhi banciphise ubungozi bokuthi i-delamination. Ukwengeza, sizoxoxa ngamasu okunciphisa ukubhekana ne-delamination (uma kwenzeka) futhi siqinisekise ukuthi i-PCB iyaqhubeka nokusebenza kahle. Ngolwazi olulungile nendlela yokwenza, i-delamination ingancishiswa, ikhulise ukusebenza kanye nempilo yokuphilaama-PCB aqinile-flex.
1. Qonda izizathu ze-stratification:
I-Delamination ingabangelwa izici ezihlukahlukene, kuhlanganise nokukhethwa kwezinto ezibonakalayo, inqubo yokukhiqiza, imvelo
izimo, kanye nokucindezeleka mechanical. Ukuhlonza nokuqonda lezi zimbangela kubalulekile ukuze kusetshenziswe ngendlela efanele
izinyathelo zokuvimbela. Ezinye izimbangela ezivamile ze-delamination kumabhodi aqinile-flex zihlanganisa:
Ukwelashwa kwendawo enganele kungenye yezizathu eziyinhloko ze-delamination yamabhodi aqinile-flex. Ukuhlanza okunganele kanye nokususwa kokungcola kungavimbela ukubopha okufanele phakathi kwezingqimba, okuholela ezibopho ezibuthakathaka kanye nokuhlukana okungenzeka. Ngakho-ke, ukulungiswa okuphelele kwendawo, okuhlanganisa ukuhlanzwa nokususwa kwezinto ezingcolile, kubalulekile ukuqinisekisa ukubopha okufanele nokuvimbela ukubola.
Ukukhetha okungalungile kwempahla kungenye into ebalulekile eholela e-delamination. Ukukhetha izinto ezingahambelani noma ezinekhwalithi ephansi kungase kubangele umehluko kuma-coefficients wokunweba okushisayo phakathi kwezendlalelo nokuhambisana kwezinto ezinganele. Lo mehluko wezakhiwo udala ingcindezi kanye nobunzima ngesikhathi sokuhamba ngebhayisikili okushisayo, okubangela ukuthi izendlalelo zihlukane. Ukucatshangelwa ngokucophelela kwezinto zokwakha kanye nezakhiwo zazo phakathi nesigaba sokuklama kubalulekile ukuze kuncishiswe ubungozi be-delamination.
Ngaphezu kwalokho, ukuphulukiswa okunganele noma ukubopha ngesikhathi sokukhiqiza kungaholela ekudaleni. Lokhu kungenzeka lapho izinto zokunamathisela ezisetshenziswa enqubweni ye-lamination zingaphuluki ngokwanele noma kusetshenziswe amasu okubopha angalungile. Ukwelapha okungaphelele noma ukunamathela kwe-interlayer okubuthakathaka kungaholela ekuxhumekeni okungazinzile, okungaholela ekudaleni. Ngakho-ke, ukulawulwa okunembile kwezinga lokushisa, ingcindezi kanye nesikhathi phakathi ne-lamination kubalulekile ukuze kuqinisekiswe isibopho esiqinile nesizinzile.
Ukushintsha kwezinga lokushisa nokuswakama ngesikhathi sokukhiqiza, ukuhlanganisa, nokusebenza nakho kungaba negalelo elibalulekile ekwenziweni kwe-delamination. Ukushintshashintsha okukhulu kwezinga lokushisa kanye nomswakama kungabangela i-PCB ukuthi inwebe ngokushisa noma imunce umswakama, okudala ingcindezi futhi kungaholela ekudambiseni. Ukuze kuncishiswe lokhu, izimo zemvelo kufanele zilawulwe futhi zenziwe ngcono ukuze kuncishiswe imiphumela yoshintsho lokushisa nomswakama.
Okokugcina, ukucindezeleka komshini ngesikhathi sokuphatha noma ukuhlanganisa kungenza buthaka isibopho phakathi kwezingqimba futhi kuholele ku-delamination. Ukuphatha okungalungile, ukugoba, noma ukweqa imikhawulo yedizayini ye-PCB kungase kubangele i-PCB ekucindezelekeni komshini okudlula amandla ebhondi ye-interlayer. Ukuze kuvinjwe i-delamination, izindlela zokuphatha ezifanele kufanele zilandelwe futhi i-PCB akufanele ibe ngaphansi kokugoba noma ingcindezi engaphezu kwemingcele ehlosiwe.
ukuqonda izizathu ze-delamination noma i-delamination yamabhodi aqinile-flex kubalulekile ekusebenziseni izinyathelo ezifanele zokuvimbela. Ukungalungiswa kahle kwendawo, ukukhetha okungalungile kwempahla, ukuphulukiswa okunganele noma ukubopha, ukushintsha kwezinga lokushisa nomswakama, kanye nokucindezeleka komshini ngesikhathi sokuphatha noma ukuhlanganisa ezinye zezimbangela ezivamile zokubola. Ngokubhekana nalezi zimbangela nokusebenzisa amasu afanele ngesikhathi sokukhiqiza, ukuhlanganisa kanye nezigaba zokuphatha, ubungozi bokwehliswa kwecala bungancishiswa, ngaleyo ndlela kuthuthukiswe ukusebenza nokuthembeka kwama-PCB aqinile.
2.Izindlela zokuvikela ezinezingqimba:
Ukuvimbela i-delamination yamabhodi aqinile-flex kudinga indlela enezici eziningi, okuhlanganisa ukucatshangelwa kokuklama, izinto ezibonakalayo
ukukhetha,izinqubo zokukhiqiza, nokuphatha ngendlela efanele. Amanye amasu okuvimbela aphumelelayo ahlanganisa
Ukucatshangelwa kwedizayini kudlala indima ebalulekile ekuvimbeleni i-delamination. Isakhiwo se-PCB esiklanywe kahle sinciphisa ingcindezi ezindaweni ezizwelayo futhi sisekela i-bend radii efanele, kunciphisa amathuba okuba i-delamination. Kubalulekile ukucabangela izingcindezi zemishini nezokushisa i-PCB engase ibe nazo phakathi nokuphila kwayo. Ukusebenzisa ama-vias anyakazayo noma anyakazayo phakathi kwezendlalelo eziseduze kunganikeza ukuzinza okwengeziwe komshini futhi kunciphise amaphuzu okugxilisa ingqondo. Le nqubo isabalalisa ingcindezi ngokulinganayo ku-PCB yonkana, inciphisa ubungozi bokuthi i-delamination. Ngaphezu kwalokho, ukusebenzisa izindiza zethusi ekwakhiweni kungasiza ekuthuthukiseni ukunamathela kanye nokukhishwa kokushisa, kunciphise ngokuphumelelayo ithuba le-delamination.
Ukukhethwa kwezinto ezibonakalayo kungenye into ebalulekile ekuvimbeleni i-delamination. Kubalulekile ukukhetha izinto ezinama-coefficients of thermal expansion (CTE) wezingxenye eziyinhloko neziguquguqukayo. Izinto ezinama-CTE angahambelani kahle zingaba nengcindezi enkulu ngesikhathi sokushintsha kwezinga lokushisa, okuholela ekudaleni. Ngakho-ke, ukukhetha izinto ezibonisa ukuhambisana ngokuya nezici zokunweba ezishisayo kungasiza ekunciphiseni ingcindezi futhi kunciphise nengozi ye-delamination. Ukwengeza, ukukhetha okunamathelayo kwekhwalithi ephezulu kanye nama-laminates aklanyelwe ngokuqondile amabhodi aqinile-flex kuqinisekisa isibopho esiqinile nokuzinza okuvimbela i-delamination ngokuhamba kwesikhathi.
Inqubo yokukhiqiza idlala indima ebalulekile ekuvimbeleni ukubola. Ukugcina izinga lokushisa elinembile kanye nokulawulwa kwengcindezi ngesikhathi sokuqhakaza kubalulekile ukuze kuzuzwe ukuhlangana okwanele phakathi kwezingqimba. Ukuchezuka ezikhathini nemibandela yokwelapha enconyiwe kungase kufake engcupheni amandla ebhondi ye-PCB nobuqotho, okwandisa amathuba okuba i-delamination. Ngakho-ke, ukubambelela ngokuqinile enqubweni yokwelapha enconywayo kubalulekile. Ukukhiqiza i-automation kusiza ukuthuthukisa ukungaguquguquki nokunciphisa ingozi yephutha lomuntu, ukuqinisekisa ukuthi inqubo ye-lamination yenziwa ngokunembile.
Ukulawulwa kwemvelo kungesinye isici esibalulekile ekuvimbeleni ukudelela. Ukudala indawo elawulwayo ngesikhathi sokukhiqiza, ukugcinwa nokuphatha okuqinile-okuguquguqukayo kunganciphisa izinga lokushisa kanye nezinguquko zomswakama ezingaholela ekunciphiseni. Ama-PCB ayazwelana nezimo zemvelo, futhi ukushintshashintsha kwezinga lokushisa nomswakama kudala ingcindezi kanye nobunzima obungaholela ekuncipheni. Ukugcina indawo elawulwayo futhi ezinzile ngesikhathi sokukhiqiza nokugcinwa kwe-PCB kunciphisa ubungozi bokuthi i-delamination. Izimo ezifanele zokugcina, njengokulawula amazinga okushisa kanye nomswakamo, nazo zibalulekile ekugcineni ubuqotho be-PCB.
Ukuphatha kahle kanye nokuphathwa kwengcindezi kubalulekile ukuvimbela i-delamination. Abasebenzi abathintekayo ekuphatheni i-PCB kufanele bathole ukuqeqeshwa okufanele futhi balandele izinqubo ezifanele ukuze banciphise ubungozi bokuphelelwa amandla ngenxa yengcindezi yemishini. Gwema ukugoba noma ukugoba ngokweqile ngesikhathi sokuhlanganisa, ukufakwa noma ukulungisa. Ukucindezelwa kwemishini okungaphezu kwemikhawulo yomklamo we-PCB kungenza buthaka isibopho phakathi kwezendlalelo, okuholela ekudaleni. Ukusebenzisa izindlela zokuzivikela, ezinjengokusebenzisa izikhwama ezilwa no-static noma amaphalethi agqinsiwe ngesikhathi sokugcinwa nokuthutha, kungaqhubeka nokunciphisa ubungozi bokulimala kanye nokuncipha.
Ukuvimbela ukuchithwa kwamabhodi aqinile-flex kudinga indlela ebanzi ehlanganisa ukucatshangelwa kwedizayini, ukukhethwa kwezinto ezibonakalayo, izinqubo zokukhiqiza, nokuphatha okufanele. Ukuklama ukwakheka kwe-PCB ukuze kuncishiswe ukucindezeleka, ukukhetha izinto ezihambisanayo ezinama-CTE afanayo, ukugcina izinga lokushisa elinembile nokulawula ingcindezi ngesikhathi sokukhiqiza, ukudala indawo elawulwayo, nokusebenzisa amasu okuphatha nokulawula ukucindezeleka wonke amasu okuvimbela aphumelelayo. Ngokusebenzisa lawa masu, ubungozi bokwehliswa kwe-delamination bungancishiswa kakhulu, kuqinisekiswe ukwethembeka nokusebenza kwesikhathi eside kwama-PCB aqinile aguquguqukayo.
3.Isu Lokunciphisa Okunezingqimba:
Naphezu kwezinyathelo zokuphepha, ama-PCB kwesinye isikhathi ahlangabezana ne-delamination. Nokho, kunamasu amaningana okunciphisa
ezingase zisetshenziswe ukuxazulula inkinga futhi kuncishiswe umthelela wayo. Lawa maqhinga abandakanya ukuhlonza nokuhlolwa,
amasu okulungisa i-delamination, ukuguqulwa komklamo, nokusebenzisana nabakhiqizi be-PCB.
Ukuhlonza nokuhlola kudlala indima ebalulekile ekwehliseni i-delamination. Ukuhlolwa okuvamile nokuhlolwa kungasiza ukuhlonza i-delamination kusenesikhathi ukuze kuthathwe izinyathelo ngesikhathi. Izindlela zokuhlola ezingonakali ezifana ne-x-ray noma i-thermography zinganikeza ukuhlaziya okuningiliziwe kwezindawo ezingase zibe yi-delamination, kwenze kube lula ukulungisa izinkinga ngaphambi kokuba zibe inkinga. Ngokuthola i-delamination kusenesikhathi, izinyathelo zingathathwa ukuvimbela ukulimala okwengeziwe nokuqinisekisa ubuqotho be-PCB.
Ngokuya ngezinga le-delamination, izindlela zokulungisa i-delamination zingasetshenziswa. Lawa masu aklanyelwe ukuqinisa izindawo ezibuthakathaka futhi abuyisele ubuqotho be-PCB. Ukusebenza kabusha okukhethiwe kuhilela ukususwa ngokucophelela kanye nokushintshwa kwezingxenye ezilimele ze-PCB ukuze kuqedwe i-delamination. Umjovo we-Adhesive ungenye indlela lapho okunamathelayo okukhethekile kufakwa ezindaweni ezincishisiwe ukuze kuthuthukiswe ukubopha nokubuyisela ubuqotho besakhiwo. I-Surface soldering nayo ingasetshenziselwa ukunamathisela kabusha ama-delaminations, ngaleyo ndlela kuqinise i-PCB. Lezi zindlela zokulungisa ziyasebenza ekubhekaneni ne-delamination nokuvimbela umonakalo owengeziwe.
Uma i-delamination iba yinkinga ephindaphindayo, ukuguqulwa komklamo kungenziwa ukuze kudambise inkinga. Ukushintsha idizayini ye-PCB kuyindlela esebenzayo yokuvimbela i-delamination ukuthi ingenzeki kwasekuqaleni. Lokhu kungase kuhlanganise ukushintsha ukwakheka kwesitaki ngokusebenzisa izinto ezihlukile noma ukwakheka, ukulungisa ukujiya kwezingqimba ukuze kuncishiswe ingcindezi nokucindezeleka, noma ukufaka izinto eziqinisayo ezengeziwe ezindaweni ezibucayi ezijwayele ukuwohloka. Ukuguqulwa komklamo kufanele kwenziwe ngokubambisana nochwepheshe ukuze kuqinisekiswe isisombululo esingcono kakhulu sokuvimbela i-delamination.
Ukusebenzisana nomkhiqizi we-PCB kubalulekile ukuze kuncishiswe i-delamination. Ukusungula ukuxhumana okuvulekile kanye nemininingwane yokwabelana mayelana nezinhlelo zokusebenza ezithile, indawo kanye nezidingo zokusebenza kungasiza abakhiqizi bathuthukise izinqubo zabo nezinto zokwakha ngokufanele. Ukusebenzisana nabakhiqizi abanolwazi olunzulu nobungcweti ekukhiqizeni i-PCB, izinkinga ze-delamination zingaxazululwa ngempumelelo. Bangahlinzeka ngemininingwane ebalulekile, baphakamise ukuguqulwa, bancome izinto ezisetshenziswayo ezifanele, futhi basebenzise amasu okukhiqiza akhethekile ukuze kuvinjelwe i-delamination.
Amasu okunciphisa i-Delamination angasiza ukubhekana nezinkinga ze-delamination kuma-PCB. Ukuhlonzwa nokuhlolwa ngokuhlola okuvamile kanye nezindlela ezingonakali kubalulekile ukuze kutholakale kusenesikhathi. Izindlela zokulungisa i-Delamination ezifana nokusebenza kabusha okukhethiwe, umjovo wokunamathisela, nokunamathisela ngaphezulu kungasetshenziswa ukuqinisa izindawo ezibuthakathaka nokubuyisela ubuqotho be-PCB. Ukuguqulwa kwedizayini nakho kungenziwa ngokubambisana nochwepheshe ukuze kuvinjwe ukuthi i-delamination ingenzeki. Okokugcina, ukusebenza nomkhiqizi we-PCB kunganikeza okokufaka okubalulekile futhi kuthuthukise izinqubo nezinto zokwakha ukuze kubhekwane ngokuphumelelayo nezinkinga zokuthi kungani. Ngokusebenzisa la masu, imiphumela ye-delamination ingancishiswa, kuqinisekiswe ukwethembeka nokusebenza kwe-PCB.
Ukususwa kwamabhodi aqinile-flex kungaba nemiphumela engathi sína ekusebenzeni nokuthembeka kwemishini kagesi. Ukuqonda imbangela nokusebenzisa amasu okuvimbela asebenzayo kubalulekile ekugcineni ubuqotho be-PCB.Izinto ezinjengokukhethwa kwempahla, izinqubo zokukhiqiza, ukulawulwa kwemvelo kanye nokuphathwa ngendlela efanele konke kunendima ebalulekile ekwehliseni ubungozi obuhambisana nokuchithwa kwe-delamination. Ingozi yokunciphisa ingancishiswa kakhulu ngokucabangela imihlahlandlela yokuklama, ukukhetha izinto ezifanele, nokusebenzisa inqubo yokukhiqiza elawulwayo. Ukwengeza, ukuhlola okusebenzayo, ukulungisa okufika ngesikhathi, kanye nokusebenzisana nochwepheshe kungasiza ekuxazululeni izinkinga ze-delamination nokuqinisekisa ukusebenza okuthembekile kwama-PCB aqinile aguquguqukayo ezinhlelweni ezihlukahlukene ze-elekthronikhi.
Isikhathi sokuthumela: Aug-31-2023
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