I-Molding Ceramic Circuit Board Substrates:Izindlela ezisetshenziswa kakhulu

Kulokhu okuthunyelwe kwebhulogi, sizobheka izindlela ezivame kakhulu ezisetshenziselwa ukubumba ama-substrates ebhodi lesifunda se-ceramic.

Ukubunjwa kwama-substrates ebhodi lesifunda se-ceramic kuyinqubo ebalulekile ekwenziweni kwemishini kagesi. Ama-substrates e-Ceramic anokuqina okuhle kakhulu kwe-thermal, amandla aphezulu emishini kanye nokwanda okushisayo okuphansi, okuwenza alungele izinhlelo zokusebenza ezifana nogesi wamandla, ubuchwepheshe be-LED kanye ne-automotive electronics.

1. Ukubumba:

Ukubunjwa kungenye yezindlela ezisetshenziswa kakhulu ukwenza ama-substrates ebhodi lesifunda se-ceramic. Kuhilela ukusebenzisa umshini wokucindezela we-hydraulic ukuze ucindezele i-ceramic powder ibe yisimo esinqunywe kusengaphambili. Impushana iqala ixutshwe nezibophezelo nezinye izithasiselo ukuze kuthuthukiswe ukugeleza kwayo kanye nepulasitiki. Ingxube ithululelwa emgodini wesikhunta futhi ingcindezi isetshenziswa ukuze kuhlanganiswe impushana. Icwecwe eliwumphumela libe selishiswa emazingeni okushisa aphakeme ukuze kukhishwe i-binder futhi kuhlanganiswe izinhlayiya ze-ceramic ndawonye ukuze kwakheke i-substrate eqinile.

2. Ukulingisa:

Ukufakwa kwe-tape kungenye indlela edumile yokwenza i-substrate yebhodi lesifunda se-ceramic, ikakhulukazi kuma-substrate amancane futhi aguquguqukayo. Ngale ndlela, i-slurry ye-ceramic powder kanye ne-solvent isakazwa endaweni eyisicaba, njengefilimu yepulasitiki. I-blade kadokotela noma i-roller bese isetshenziswa ukulawula ukushuba kodaka. I-solvent iyahwamuka, ishiye itheyiphu encane eluhlaza, engase isikwe ibe yisimo oyifunayo. Itheyiphu eluhlaza ibe isicwiliswa ukuze kukhishwe noma iyiphi i-solvent ne-binder esele, okuholela ku-substrate eminyene ye-ceramic.

3. Ukubumba umjovo:

Ukubumba umjovo kuvame ukusetshenziselwa ukubumba izingxenye zepulasitiki, kodwa kungasetshenziselwa ama-substrates ebhodi lesifunda se-ceramic. Indlela ihilela ukujova impushana ye-ceramic exutshwe ne-binder emgodini wesikhunta ngaphansi kwengcindezi ephezulu. Isikhunta sibe sesishisiswa ukuze kukhishwe i-binder, bese umzimba oluhlaza owumphumela ushiswa ukuze uthole i-substrate yokugcina ye-ceramic. Ukubumba komjovo kunikeza izinzuzo zejubane lokukhiqiza elisheshayo, izingxenye eziyinkimbinkimbi zejometri kanye nokunemba okuhle kakhulu kobukhulu.

4. I-Extrusion:

Ukubunjwa kwe-Extrusion kusetshenziswa kakhulu ukwenza ama-substrates ebhodi lesifunda se-ceramic anomumo oyinkimbinkimbi we-cross-sectional, njengamashubhu noma amasilinda. Inqubo ihilela ukuphoqelela i-plasticized slurry ceramic ngokusebenzisa isikhunta esinomumo oyifunayo. Unamathisele ube esesikwa ngobude obufunayo futhi yomiswe ukuze kususwe noma yimuphi umswakama osele noma isincibiliki. Izingxenye eziluhlaza ezomisiwe zibe sezixoshwa ukuze kutholwe i-substrate yokugcina ye-ceramic. I-Extrusion inika amandla ukukhiqizwa okuqhubekayo kwama-substrates anobukhulu obungaguquki.

5. Ukuphrinta kwe-3D:

Ngokufika kobuchwepheshe bokukhiqiza okungeziwe, ukuphrinta kwe-3D sekuyindlela esebenzayo yokubumba ama-substrates ebhodi lesifunda se-ceramic. Ekuphrinteni kwe-ceramic ye-3D, impushana ye-ceramic ixutshwa nesibophezelo ukuze kwakhe ukunamathisela okuphrintekayo. Udaka lube selufakwa ungqimba ngongqimba, lulandela umklamo owenziwe ngekhompuyutha. Ngemva kokunyathelisa, izingxenye eziluhlaza ziyashiswa ukuze kukhishwe i-binder futhi kuhlanganiswe izinhlayiya ze-ceramic ndawonye ukuze zakhe i-substrate eqinile. Ukuphrinta kwe-3D kunikeza ukuguquguquka okuhle kokuklama futhi kungakhiqiza ama-substrates ayinkimbinkimbi nangokwezifiso.

Kafushane

Ukubunjwa kwama-substrates ebhodi lesifunda se-ceramic kungaqedwa ngezindlela ezihlukahlukene ezifana nokubumba, ukubunjwa kwe-tape, ukubunjwa komjovo, i-extrusion kanye nokuphrinta kwe-3D. Indlela ngayinye inezinzuzo zayo, futhi ukukhetha kusekelwe ezicini ezifana nesimo esifiselekayo, ukuphuma, ubunzima, kanye nezindleko. Ukukhethwa kwendlela yokwenza ekugcineni kunquma ikhwalithi nokusebenza kwe-ceramic substrate, okwenza kube isinyathelo esibalulekile enqubweni yokukhiqiza idivayisi ye-elekthronikhi.