Isingeniso: Izinselele zobuchwepheshe ku-Automotive Electronics kanyeI-Capel Innovations

Njengoba ukushayela okuzenzakalelayo kuguqukela ku-L5 kanye nezinhlelo zokuphatha amabhethri emoto kagesi (EV) (BMS) zidinga ukuminyana kwamandla nokuphepha okuphezulu, ubuchwepheshe be-PCB bendabuko budonsa kanzima ukubhekana nezinkinga ezibucayi:

• Thermal Runaway Izingozi: Ama-chipset e-ECU adlula ukusetshenziswa kwamandla okungu-80W, nezinga lokushisa lendawo elifinyelela ku-150°C
• Imikhawulo ye-3D Integration: I-BMS idinga iziteshi zesignali ezingu-256+ ngaphakathi kogqinsi lwebhodi elingu-0.6mm
• Ukuhluleka kokudlidliza: Izinzwa ezizimele kufanele zimelane nokushaqeka kwemishini kwe-20G
• Izidingo ze-Miniaturization: Izilawuli ze-LiDAR zidinga ububanzi bokulandela umkhondo obungu-0.03mm kanye nokupakishwa kwezingqimba ezingu-32

I-Capel Technology, esebenzisa iminyaka engu-15 ye-R&D, yethula isisombululo esiguqulayo esihlanganisayohigh conductivity ezishisayo PCBs(2.0W/mK),ama-PCB amelana nokushisa okuphezulu(-55°C~260°C), futhi32-ungqimbaI-HDI yangcwatshwa/impumputhe ngobuchwepheshe(0.075mm ama-microvias).

Isigaba 1: Uguquko Lokulawulwa Okushisayo kwama-ECUs Okushayela Ngokuzenzakalelayo

1.1 Izinselelo ze-ECU ezishisayo

• I-Nvidia Orin chipset heat flux density: 120W/cm²
• Ama-substrates avamile e-FR-4 (0.3W/mK) abangela ukudlula izinga lokushisa elingu-35% le-chip junction
• I-62% yokwehluleka kwe-ECU isuka ekukhathaleni kwe-solder okubangelwa ukushisa okushisayo

1.2 I-Capel's Thermal Optimization Technology

Izinto Ezintsha Ezintsha:

• I-Nano-alumina eqinisiwe ye-polyimide substrates (2.0±0.2W/mK conductivity eshisayo)
• Izinhlaka ze-3D zensika yethusi (400% yandise indawo yokulahla ukushisa)

Ukuthuthukiswa Kwenqubo:

• I-Laser Direct Structuring (LDS) yezindlela zokushisa ezithuthukisiwe
• Ukupakishwa kweHybrid: 0.15mm yethusi elincanyana kakhulu + 2oz izendlalelo zethusi esindayo

Ukuqhathanisa Ukusebenza:

Isigaba 2: I-BMS Wiring Revolution enobuchwepheshe be-HDI obungama-32

2.1 Amaphuzu Obuhlungu Bemboni Kumklamo we-BMS

• Amapulatifomu angu-800V adinga iziteshi zokuqapha amandla kagesi wamaselula angu-256+
• Imiklamo evamile yeqa imikhawulo yesikhala ngo-200% ngokungafani okungama-15%.

2.2 Izixazululo ze-Capel's High-Density Interconnect

Ubunjiniyela Besitaki:

• I-1+N+1 yanoma yisiphi isendlalelo se-HDI (izendlalelo ezingu-32 ku-0.035mm ukujiya)
• ± 5% ukulawulwa kwe-impedance ehlukile (amasiginali we-10Gbps anesivinini esikhulu)

I-Microvia Technology:

• 0.075mm laser-blind vias (12:1 ukubukeka kwesilinganiselo)
• <5% isilinganiso se-plating void (I-IPC-6012B Class 3 iyahambisana)

Imiphumela yeBenchmark:

Isigaba 3: Ukuthembeka Okudlulele Kwendawo - Izixazululo Eziqinisekisiwe ze-MIL-SPEC

3.1 Ukusebenza Kwezinto Ezisezingeni Eliphezulu

• I-Glass Transition Temp (Tg): 280°C (IPC-TM-650 2.4.24C)
• I-Decomposition Temp (Td): 385°C (5% ukuncipha kwesisindo)
• Ukusinda Kwe-Thermal Shock: Imijikelezo engu-1,000 (-55°C↔260°C)

3.2 Ubuchwepheshe bokuvikela ubunikazi

• I-Plasma-grafted polymer coating (1,000h ukumelana nesifutho sikasawoti)
• I-3D EMI shielding cavities (60dB attenuation @10GHz)

Isigaba sesi-4: Indaba efundwayo - Ukusebenzisana ne-Global Top 3 EV OEM

4.1 800V BMS Control Module

• Inselele: Hlanganisa i-512-channel AFE esikhaleni esingu-85×60mm
• Isixazululo:
  1. I-PCB enezingqimba ezingama-20 eqinile-eguquguqukayo (i-3mm bend radius)
  2. Inethiwekhi yenzwa yokushisa eshumekiwe (ububanzi bokulandelela okungu-0.03mm)
  3. Ukupholisa okwendawo kwensimbi-core (0.15°C·cm²/W ukumelana nokushisa)

4.2 L4 I-Autonomous Domain Controller

• Imiphumela:
  • Ukunciphisa amandla ngo-40% (72W → 43W)
  • 66% ukuncishiswa kosayizi uma kuqhathaniswa nemiklamo evamile
  • Isitifiketi sokuphepha esisebenzayo se-ASIL-D

Isigaba 5: Izitifiketi Nokuqinisekiswa Kwekhwalithi

Isistimu yekhwalithi ye-Capel idlula izindinganiso zezimoto:

• Isitifiketi se-MIL-SPEC: Ihambisana ne-GJB 9001C-2017
• Ukuthobela Izimoto: IATF 16949:2016 + AEC-Q200 ukuqinisekiswa
• Ukuhlola Ukuthembeka:
  • 1,000h HAST (130°C/85% RH)
  • I-50G mechanical shock (MIL-STD-883H)

Isiphetho: I-Next-Gen PCB Technology Roadmap

U-Capel ungumbungazi ohamba phambili

• Izingxenye ze-passive ezishumekiwe (30% ukonga isikhala)
• Ama-PCB e-Optoelectronic hybrid (0.2dB/cm ukulahlekelwa @850nm)
• Amasistimu e-DFM aqhutshwa yi-AI (ukuthuthukiswa kwesivuno esingu-15%)

Xhumana nethimba lethu lonjiniyelanamuhla ukuthuthukisa ngokubambisana izixazululo ze-PCB ezenziwe ngezifiso zohlobo lwakho olulandelayo lwe-automotive electronics.