I-Heavy Copper Pcb |Ithusi Elijiyile | I-PCB Copper PCB Surface Qeda

Emhlabeni wamabhodi esekethe aphrintiwe (ama-PCB), ukukhetha kokuqedwa kwendawo kubalulekile ekusebenzeni okuphelele nasekuphileni isikhathi eside kwamadivayisi kagesi. Ukwelashwa okungaphezulu kunikeza i-coating evikelayo ukuze kuvinjelwe i-oxidation, ukuthuthukisa ukuthengiselana, kanye nokuthuthukisa ukwethembeka kukagesi kwe-PCB. Olunye uhlobo lwe-PCB oludumile i-PCB yethusi ewugqinsi, eyaziwa ngekhono layo lokusingatha imithwalo yamanje ephezulu futhi inikeze ukuphathwa okungcono kokushisayo. Nokho,umbuzo ovame ukuvela uthi: Ingabe ama-PCB e-copper aminyene angenziwa anemibala ehlukene? Kulesi sihloko, sizohlola izinketho ezihlukahlukene zokuqeda phezulu ezitholakalayo ze-PCB zethusi eziqinile kanye nokucatshangelwa okuhilelekile ekukhetheni isiphetho esifanele.

1.Funda mayelana nama-PCB e-Heavy Copper

Ngaphambi kokuhlolisisa izinketho zokuqeda phezulu, kuyadingeka ukuqonda ukuthi iyini i-PCB yethusi ewugqinsi kanye nezici zayo ezithile. Ngokuvamile, ama-PCB anogqinsi lwethusi angaphezu kwama-ounces angu-3 (105 µm) athathwa njengama-PCB ekhopha aminyene. Lawa mabhodi aklanyelwe ukuthwala ama-currents aphezulu futhi ahlakaze ukushisa kahle, okuwenza afaneleke kugesi wamandla, izimoto, izinhlelo zokusebenza ze-aerospace namanye amadivaysi anezidingo zamandla aphezulu. Ama-PCB ekhopha aminyene anikezela ngokusebenza kahle kwe-thermal, amandla aphezulu emishini kanye nokwehla kwamandla kagesi aphansi kunama-PCB ajwayelekile.

2.Ukubaluleka kokwelashwa kwendawo ekukhiqizeni i-Heavy Copper Pcb:

Ukulungiswa kwendawo kudlala indima ebalulekile ekuvikeleni iminonjana yethusi namaphedi ku-oxidation nokuqinisekisa amalunga athembekile e-solder. Zisebenza njengesithiyo phakathi kwethusi eliveziwe kanye nezingxenye zangaphandle, ukuvimbela ukugqwala nokugcina i-solderability. Ukwengeza, ukuqedwa kwangaphezulu kusiza ukunikeza indawo eyisicaba yokubeka ingxenye kanye nezinqubo zokubopha izintambo. Ukukhetha isiphetho esilungile sama-PCB ethusi ethusi kubalulekile ekwandiseni ukusebenza kwawo nokuthembeka.

3.Izinketho zokwelapha ezingaphezulu ze-Heavy Copper PCB:

Ukulinganisa i-solder yomoya oshisayo (HASL):
I-HASL ingenye yezindlela zokwelapha ze-PCB ezivamile nezingabizi kakhulu. Kule nqubo, i-PCB icwiliswa ekugezeni kwe-solder encibilikisiwe futhi i-solder eyeqile iyasuswa kusetshenziswa ummese womoya oshisayo. I-solder esele yenza ungqimba oluqinile endaweni yethusi, ivikele ukugqwala. Nakuba i-HASL iyindlela yokwelapha engaphezulu esetshenziswa kakhulu, akuyona inketho engcono kakhulu yama-PCB ethusi eliwugqinsi ngenxa yezici ezihlukahlukene. Amazinga okushisa aphezulu okusebenza ahilelekile kule nqubo angabangela ingcindezi yokushisa ezingqimbeni zethusi eziwugqinsi, kubangele i-warping noma i-delamination.
I-Electroless nickel immersion gold plating (ENIG):
I-ENIG iyinketho ethandwayo yokwelashwa okungaphezulu futhi yaziwa ngokushisela kwayo okuhle kakhulu kanye nokumelana nokugqwala. Kuhilela ukufaka ungqimba oluncane lwe-nickel engena-electro bese ufaka ungqimba lwegolide lokucwiliswa endaweni yethusi. I-ENIG inesiphetho esiyisicaba, esibushelelezi, okuyenza ifaneleke izingxenye ezinephimbo elihle kanye nokuhlanganisa igolide ngocingo. Nakuba i-ENIG ingasetshenziswa kuma-PCB ethusi aminyene, kubalulekile ukucabangela ukushuba kongqimba lwegolide ukuze kuqinisekiswe ukuvikeleka okwanele kumagagasi aphezulu kanye nemiphumela yokushisa.
I-Electroless Nickel Plating Electroless Palladium Immersion Gold (ENEPIG):
I-ENEPIG iwukwelapha okuseqophelweni eliphezulu okuhlinzeka ngokuthengiseka okuhle kakhulu, ukumelana nokugqwala kanye nokubopha ngocingo. Kuhilela ukufaka ungqimba lwe-nickel engena-electro, bese kuba ungqimba lwe-electroless palladium, futhi ekugcineni ungqimba lwegolide lokucwiliswa. I-ENEPIG inikeza ukuqina okuhle kakhulu futhi ingasetshenziswa kuma-PCB ethusi aminyene. Inikeza isiphetho esimangelengele, siyenze ifanele ukusetshenziswa kwamandla aphezulu kanye nezingxenye zephimbo elihle.
Ithini lokucwiliswa (ISn):
I-Immersion tin ingenye indlela yokwelashwa kwendawo yama-PCB ethusi aminyene. Icwilisa i-PCB esixazululweni esisekelwe kuthini, yenze ungqimba oluncane lwethini endaweni yethusi. Ithayela lokucwiliswa linikeza ukudayiswa okuhle kakhulu, indawo eyisicaba, futhi linobungani bemvelo. Kodwa-ke, ukucatshangelwa okukodwa lapho usebenzisa ithini lokucwiliswa kuma-PCB ethusi aminyene ukuthi ubukhulu bongqimba lwethini kufanele bulawulwe ngokucophelela ukuze kuqinisekiswe ukuvikeleka okwanele ngokumelene ne-oxidation nokugeleza okuphezulu kwamanje.
I-Organic solderability preservative (OSP):
I-OSP iwukwelapha okungaphezulu okudala ukunamathela kwemvelo okuvikelayo ezindaweni zethusi eziveziwe. Ine-solderability enhle futhi iyabiza. I-OSP ilungele ukusetshenziswa kwamandla aphansi kuya kwaphakathi futhi ingasetshenziswa kuma-PCB ethusi aminyene inqobo nje uma umthamo wamanje wokuthwala kanye nezidingo zokulahla okushisayo kuhlangatshezwana nazo. Esinye sezici okufanele sicatshangelwe lapho usebenzisa i-OSP kuma-PCB ethusi eliwugqinsi ukujiya okwengeziwe kwe-organic coating, okungase kuthinte ukusebenza kukagesi nokushisayo kukonke.

4.Izinto okufanele uzicabangele lapho ukhetha indawo engaphezulu yama-PCB e-Heavy Copper:Lapho ukhetha isiphetho esingaphezulu se-Heavy

I-Copper PCB, kunezici ezimbalwa okufanele zicatshangelwe:

Ikhono Lamanje Lokuthwala:
Ama-PCB e-copper aminyene asetshenziswa ngokuyinhloko ezinhlelweni zamandla aphezulu, ngakho-ke kubalulekile ukukhetha indawo engaphezulu engathwala imithwalo yamanje ephezulu ngaphandle kokumelana okubalulekile noma ukushisa ngokweqile. Izinketho ezifana ne-ENIG, ENEPIG, kanye ne-immersion tin ngokuvamile zilungele izinhlelo zokusebenza zamanje eziphezulu.
Ukuphatha Okushisayo:
I-PCB yethusi ewugqinsi yaziwa ngokusebenza kwayo okushisayo okuhle kakhulu namandla okukhipha ukushisa. Ukuqedwa okungaphezulu akufanele kuvimbele ukudluliswa kokushisa noma kubangele ukucindezeleka okushisayo okweqile kungqimba lwethusi. Ukwelapha okungaphezulu okufana ne-ENIG ne-ENEPIG kunezendlalelo ezincane ezivame ukuzuzisa ukuphathwa kokushisa.
I-Solderability:
Ukuqedwa kwe-Surface kufanele kunikeze ukuthengiselana okuhle kakhulu ukuze kuqinisekiswe amalunga athembekile e-solder kanye nokusebenza kahle kwengxenye. Izinketho ezifana ne-ENIG, ENEPIG ne-HASL zinikeza ukuthengiswa okuthembekile.
Ukuhambisana Kwengxenye:
Cabangela ukuhambisana kokuqedwa kwendawo ekhethiwe nezingxenye ezithile ezizofakwa ku-PCB. Izingxenye ze-fine pitch kanye ne-golden wire bonding kungase kudinge ukwelashwa okungaphezulu okufana ne-ENIG noma i-ENEPIG.
Izindleko:
Izindleko zihlale zicatshangelwa ezibalulekile ekukhiqizeni i-PCB. Izindleko zokwelashwa okuhlukile kwendawo ziyahlukahluka ngenxa yezinto ezifana nezindleko zempahla, ubunkimbinkimbi benqubo kanye nezinto zokusebenza ezidingekayo. Linganisa umthelela wezindleko zokuqedwa kwendawo ekhethiwe ngaphandle kokuphazamisa ukusebenza nokuthembeka.

Ama-PCB ethusi aqinile anikeza izinzuzo ezihlukile zezinhlelo zokusebenza zamandla aphezulu, futhi ukukhetha indawo engaphezulu efanele kubalulekile ukuze kuthuthukiswe ukusebenza kwawo nokwethembeka.Nakuba izinketho zendabuko ezifana ne-HASL zingase zingafaneleki ngenxa yezinkinga ezishisayo, ukwelapha okungaphezulu okufana ne-ENIG, ENEPIG, i-immersion tin ne-OSP kungacatshangelwa kuye ngezidingo ezithile. Izinto ezifana nekhono lamanje lokuthwala, ukuphatha okushisayo, ukudayiswa, ukuhambisana kwengxenye kanye nezindleko kufanele zihlolwe ngokucophelela lapho kukhethwa isiphetho sama-PCB ethusi aminyene. Ngokwenza izinqumo ezihlakaniphile, abakhiqizi bangaqinisekisa ukukhiqiza okuphumelelayo nokusebenza kwesikhathi eside kwama-PCB ethusi aminyene kuzinhlelo zokusebenza ezihlukene zikagesi neze-elekthronikhi.