I-FPC Flex PCB Manufacturing: Isingeniso Senqubo Yokwelashwa Okungaphezulu

Lesi sihloko sizohlinzeka ngemininingwane ebanzi yenqubo yokwelashwa kwendawo yokwenziwa kwe-FPC Flex PCB. Kusukela ekubalulekeni kokulungiswa kwendawo kuya ezindleleni ezihlukene zokumboza, sizofaka ulwazi oluyisihluthulelo ukukusiza ukuthi uqonde futhi usebenzise inqubo yokulungisa indawo engaphezulu ngempumelelo.

Isingeniso:

I-Flexible PCBs (Flexible Printed Circuit Boards) athola ukuduma kuzo zonke izimboni ezihlukahlukene ngenxa yokuguquguquka nekhono lokujwayela izimo eziyinkimbinkimbi. Izinqubo zokulungiselela indawo engaphezulu zidlala indima ebalulekile ekuqinisekiseni ukusebenza kahle nokuthembeka kwalawa masekethi aguquguqukayo. Lesi sihloko sizohlinzeka ngemininingwane ebanzi yenqubo yokwelashwa kwendawo yokwenziwa kwe-FPC Flex PCB. Kusukela ekubalulekeni kokulungiswa kwendawo kuya ezindleleni ezihlukene zokumboza, sizofaka ulwazi oluyisihluthulelo ukukusiza ukuthi uqonde futhi usebenzise inqubo yokulungisa indawo ngokuphumelelayo.

Okuqukethwe:

1. Ukubaluleka kokwelashwa kwendawo ekukhiqizeni i-FPC flex PCB:

Ukwelashwa okungaphezulu kubalulekile ekwenziweni kwamabhodi e-FPC Flexible njengoba kufeza izinjongo eziningi. Isiza i-soldering, iqinisekise ukunamathela okuhle, futhi ivikele iminonjana ye-conductive kusuka ku-oxidation kanye nokucekelwa phansi kwemvelo. Ukukhetha kanye nekhwalithi yokwelashwa okungaphezulu kuthinta ngqo ukuthembeka nokusebenza kukonke kwe-PCB.

Ukuqedwa kobuso ekukhiqizeni i-FPC Flex PCB kufeza izinjongo ezibalulekile ezimbalwa.Okokuqala, kusiza ukuhlanganisa, ukuqinisekisa ukubopha okufanele kwezingxenye ze-elekthronikhi ku-PCB. Ukwelashwa okungaphezulu kuthuthukisa ukuthengiselana ukuze kube nokuxhumana okuqinile nokwethembeke kakhudlwana phakathi kwengxenye ne-PCB. Ngaphandle kokulungiswa kwendawo efanele, amalunga e-solder angaba buthakathaka futhi athambekele ekuhlulekeni, okuholela ekungasebenzi kahle kanye nokulimala okungenzeka kuwo wonke isifunda.
Esinye isici esibalulekile sokulungiswa kwendawo ekukhiqizeni i-FPC Flex PCB ukuqinisekisa ukunamathela okuhle.Ama-PCB aguquguqukayo e-FPC ngokuvamile ahlangabezana nokugoba nokuguquguquka okukhulu ngesikhathi sempilo yawo yesevisi, okubeka ingcindezi ku-PCB nezingxenye zayo. Ukwelashwa okungaphezulu kunikeza ungqimba lokuvikela ukuze kuqinisekiswe ukuthi ingxenye inamathela ngokuqinile ku-PCB, ukuvimbela ukuqoqwa okungaba khona noma ukulimala ngesikhathi sokuphatha. Lokhu kubaluleke kakhulu ezinhlelweni zokusebenza lapho ukucindezeleka komshini noma ukudlidliza kuvame.
Ukwengeza, ukwelashwa okungaphezulu kuvikela imikhondo ye-conductive ku-FPC Flex PCB ekungcolisweni nasekucekeleni phansi kwemvelo.Lawa ma-PCB ahlala echayeke ezicini ezihlukahlukene zemvelo ezifana nomswakama, izinguquko zokushisa namakhemikhali. Ngaphandle kokulungiswa okwanele kwendawo, imikhondo ye-conductive ingagqwala ngokuhamba kwesikhathi, ibangele ukwehluleka kukagesi kanye nokwehluleka kwesekethe. Ukwelashwa okungaphezulu kusebenza njengesithiyo, kuvikela i-PCB endaweni ezungezile futhi kwandise ukuphila kwayo nokwethembeka.

2.Izindlela ezijwayelekile zokwelashwa kwendawo yokukhiqiza i-FPC flex PCB:

Lesi sigaba sizoxoxa ngokuningiliziwe ngezindlela ezivame ukusetshenziswa kakhulu zokwelashwa kwendawo ekukhiqizeni amabhodi e-FPC Flexible, okuhlanganisa i-Hot Air Solder Leveling (HASL), i-Electroless Nickel Immersion Gold (ENIG), i-Organic Solderability Preservative (OSP), i-Immersion Tin (ISn) kanye ne-electroplating. (E-plating). Indlela ngayinye izochazwa kanye nezinzuzo zayo kanye nebubi bayo.

I-Hot Air Solder Leveling (HASL):
I-HASL iyindlela yokwelapha engaphezulu esetshenziswa kakhulu ngenxa yokusebenza kahle kwayo kanye nokusebenza kahle kwezindleko. Le nqubo ihilela ukumboza indawo yethusi ngongqimba lwe-solder, olushiswa ngomoya oshisayo ukuze kwakheka indawo ebushelelezi, eyisicaba. I-HASL inikeza ukuthengiselana okuhle kakhulu futhi iyahambisana nezinhlobonhlobo zezingxenye nezindlela zokunamathisela. Kodwa-ke, futhi inemikhawulo efana nokungalingani kwendawo kanye nokulimala okungenzeka kumamaki athambile ngesikhathi sokucutshungulwa.
I-Electroless Nickel Immersion Gold (ENIG):
I-ENIG iyisinqumo esidumile ekwenziweni kwesekethe eguquguqukayo ngenxa yokusebenza kwayo okuphezulu nokuthembeka. Le nqubo ihilela ukufaka ungqimba oluncane lwe-nickel endaweni yethusi ngokusabela kwamakhemikhali, abese ecwiliswa kusixazululo se-electrolyte esinezinhlayiya zegolide. I-ENIG inokumelana nokugqwala okuhle kakhulu, ukusatshalaliswa kokuqina okufanayo kanye nokuqina okuhle. Kodwa-ke, izindleko eziphezulu ezihlobene nenqubo kanye nezinkinga ezingase zibe khona zamaphedi amnyama ezinye zezithiyo okufanele zicatshangelwe.
I-Organic Solderability Preservative (OSP):
I-OSP iyindlela yokwelapha engaphezulu ehlanganisa ukumboza indawo yethusi ngefilimu elincanyana lezinto eziphilayo ukuze ivinjwe ukuthi i-oxidizing. Le nqubo ihambisana nemvelo njengoba iqeda isidingo sezinsimbi ezinzima. I-OSP inikeza indawo eyisicaba kanye nokuthengiselana okuhle, okuyenza ifaneleke izingxenye zephimbo elihle. Kodwa-ke, i-OSP inempilo yeshelufu elinganiselwe, iyazwela ekuphathweni, futhi idinga izimo zokulondoloza ezifanele ukuze igcine ukusebenza kwayo.
Ithini lokucwiliswa (ISn):
I-ISn iyindlela yokwelapha engaphezulu ebandakanya ukucwiliswa kwesiyingi esivumelana nezimo kubhavu wethini elincibilikisiwe. Le nqubo yakha ungqimba oluncane lwethini endaweni yethusi, enokuqina okuhle kakhulu, ukucaba kanye nokumelana nokugqwala. I-ISn ihlinzeka ngokuqeda okubushelelezi okuyenza ilungele ukusetshenziswa kwephimbo elihle. Kodwa-ke, inokumelana nokushisa okulinganiselwe futhi ingadinga ukuphathwa okukhethekile ngenxa yokuqina kwe-tin.
I-Electroplating (E Plating):
I-Electroplating iyindlela evamile yokwelashwa kwendawo ekukhiqizeni isekethe eguquguqukayo. Inqubo ihilela ukufaka ungqimba lwensimbi endaweni yethusi ngokusabela kwe-electrochemical. Ngokuya ngezidingo zohlelo lokusebenza, i-electroplating iyatholakala ngezinketho ezahlukahlukene njengegolide, isiliva, i-nickel noma i-tin plating. Inikeza ukuqina okuhle kakhulu, i-solderability kanye nokumelana nokugqwala. Kodwa-ke, kubiza kakhulu uma kuqhathaniswa nezinye izindlela zokwelapha ezingaphezulu futhi kudinga imishini eyinkimbinkimbi nezilawuli.

3.Izinyathelo zokuphepha zokukhetha indlela yokwelapha engaphezulu efanele ekukhiqizeni i-FPC flex PCB:

Ukukhetha isiphetho esilungile samasekhethi e-FPC aguquguqukayo kudinga ukucatshangelwa ngokucophelela kwezici ezihlukahlukene ezifana nokusetshenziswa, izimo zemvelo, izidingo zokuthengiselana, kanye nokusebenza kahle kwezindleko. Lesi sigaba sizonikeza isiqondiso ekukhetheni indlela efanele ngokusekelwe kulokhu okucatshangelwayo.

Yazi izidingo zamakhasimende:
Ngaphambi kokuhlolisisa izindlela zokwelapha ezihlukahlukene ezitholakalayo, kubalulekile ukuba nokuqonda okucacile ngezidingo zamakhasimende. Cabangela izici ezilandelayo:

Isicelo:
Nquma ukusetshenziswa okuhlosiwe kwe-FPC yakho eguquguqukayo PCB. Ingabe okokusebenza kukagesi kwabathengi, ezezimoto, ezokwelashwa noma zezimboni? Imboni ngayinye ingaba nezidingo ezithile, njengokumelana nezinga lokushisa eliphezulu, amakhemikhali noma ukucindezeleka kwemishini.
Izimo Zemvelo:
Linganisa izimo zemvelo i-PCB ezohlangabezana nazo. Ingabe izochayeka kumswakama, umswakama, amazinga okushisa adlulele noma izinto ezibolayo? Lezi zici zizoba nomthelela endleleni yokulungiswa kwendawo ukuze inikeze isivikelo esingcono kakhulu ekungcolisweni kwe-oxidation, ukugqwala nokunye ukuwohloka.
Izidingo ze-Solderability:
Hlaziya izidingo ze-solderability ze-FPC flexible PCB. Ingabe ibhodi lizodlula kunqubo ye-wave soldering noma ye-reflow soldering? Ukwelashwa okuhlukile okungaphezulu kunokuhambisana okuhlukile nalezi zindlela zokushisela. Ukucabangela lokhu kuzoqinisekisa amalunga e-solder athembekile futhi kuvimbele izinkinga ezifana nokukhubazeka kwe-solderability futhi kuvule.

Hlola Izindlela Zokwelapha Ezingaphezulu:
Ngokuqonda okucacile kwezidingo zamakhasimende, sekuyisikhathi sokuhlola izindlela zokwelapha ezitholakalayo:

I-Organic Solderability Preservative (OSP):
I-OSP iyi-ejenti yokwelapha engaphezulu edumile ye-FPC flexible PCB ngenxa yezindleko zayo nezici zokuvikela imvelo. Inikeza ungqimba oluncane oluvikelayo oluvimbela i-oxidation futhi lusize ukuhlanganisa. Nokho, i-OSP ingaba nokuvikelwa okulinganiselwe ezindaweni ezinokhahlo kanye nempilo yeshelufu emfushane kunezinye izindlela.
I-Electroless Nickel Immersion Gold (ENIG):
I-ENIG isetshenziswa kabanzi ezimbonini ezahlukahlukene ngenxa yokudayiswa kwayo okuhle kakhulu, ukumelana nokugqwala kanye nokucaba. Isendlalelo segolide siqinisekisa ukuxhumana okuthembekile, kuyilapho ungqimba lwe-nickel lunikeza ukumelana okuhle kakhulu kwe-oxidation nokuvikelwa kwemvelo okuqinile. Kodwa-ke, i-ENIG ibiza kakhulu uma iqhathaniswa nezinye izindlela.
Igolide Eliqinile Elifakwe Electroplated (Igolide Eliqinile):
Igolide eliqinile lihlala isikhathi eside futhi linikeza ukwethembeka okuhle kakhulu kokuxhumana, okulenza lifaneleke izinhlelo zokusebenza ezifaka ukufakwa okuphindaphindiwe kanye nezindawo zokugqoka okuphezulu. Nokho, iyinketho yokuqeda ebiza kakhulu futhi ingase ingadingeki kulo lonke uhlelo lokusebenza.
I-Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG):
I-ENEPIG iyi-ejenti yokwelapha yangaphezulu enemisebenzi eminingi elungele ukusetshenziswa okuhlukahlukene. Ihlanganisa izinzuzo zezendlalelo ze-nickel nezegolide nenzuzo eyengeziwe yongqimba oluphakathi lwe-palladium, ihlinzeka ngokubopheka okuhle kakhulu kwentambo nokumelana nokugqwala. Kodwa-ke, i-ENEPIG ijwayele ukubiza kakhulu futhi ibe yinkimbinkimbi ukuyicubungula.

4.Umhlahlandlela obanzi wesinyathelo ngesinyathelo sezinqubo zokulungiselela indawo ekukhiqizeni i-FPC eguquguqukayo ye-PCB:

Ukuqinisekisa ukuqaliswa ngempumelelo kwezinqubo zokulungiswa kwendawo, kubalulekile ukulandela indlela ehlelekile. Lesi sigaba sizohlinzeka ngomhlahlandlela oningiliziwe wesinyathelo ngesinyathelo ohlanganisa ukwelashwa ngaphambi kwesikhathi, ukuhlanzwa kwamakhemikhali, ukufakwa kwe-flux, ukumbozwa kwendawo kanye nezinqubo zangemuva kokwelashwa. Isinyathelo ngasinye sichazwa kahle, sigqamisa amasu afanele kanye nezinqubo ezingcono kakhulu.

Isinyathelo 1: Ukucubungula kusengaphambili
Ukwelashwa kusengaphambili kuyisinyathelo sokuqala sokulungiswa kwendawo futhi kuhlanganisa ukuhlanzwa nokususwa kokungcoliswa kwendawo.
Qala uhlole indawo engaphezulu ukuze uthole noma yimuphi umonakalo, ukungapheleli noma ukugqwala. Lezi zinkinga kufanele zixazululwe ngaphambi kokuba kuthathwe esinye isinyathelo. Okulandelayo, sebenzisa umoya ocindezelweyo, ibhulashi, noma ivacuum ukuze ususe noma yiziphi izinhlayiya ezixegayo, uthuli, noma ukungcola. Ukuze uthole ukungcola okunenkani eyengeziwe, sebenzisa isincibilikisi noma isihlanzi samakhemikhali esakhelwe ngokukhethekile izinto ezingaphezulu. Qinisekisa ukuthi indawo yomile kahle ngemva kokuhlanza, njengoba umswakama osele ungaphazamisa izinqubo ezilandelayo.
Isinyathelo sesi-2: Ukuhlanza Amakhemikhali
Ukuhlanza amakhemikhali kubandakanya ukususa noma yikuphi ukungcola okusele endaweni.
Khetha ikhemikhali yokuhlanza efanele ngokusekelwe ezintweni ezingaphezulu kanye nohlobo lokungcola. Gcoba isihlanzi ngokulinganayo phezulu futhi uvumele isikhathi esanele sokuthintana ukuze ususwe ngempumelelo. Sebenzisa ibhulashi noma iphedi yokukhuhla ngobumnene indawo engaphezulu, unake izindawo okunzima ukufinyelela kuzo. Hlanza indawo yonke ngamanzi ukuze ususe noma iyiphi insalela yesihlanzi. Inqubo yokuhlanza amakhemikhali iqinisekisa ukuthi indawo engaphezulu ihlanzekile ngokuphelele futhi ilungele ukucutshungulwa okulandelayo.
Isinyathelo sesi-3: Isicelo se-Flux
Ukusetshenziswa kwe-flux kubalulekile enqubweni ye-brazing noma ye-soldering njengoba ikhuthaza ukunamathela okungcono futhi inciphisa i-oxidation.
Khetha uhlobo olufanele lwe-flux ngokuya ngezinto okufanele zixhunywe kanye nezidingo zenqubo ethile. Faka i-flux ngokulinganayo endaweni ehlangene, uqinisekise ukumbozwa okuphelele. Qaphela ukuthi ungasebenzisi i-flux eyeqile ngoba ingase ibangele izinkinga ze-soldering. I-Flux kufanele isetshenziswe ngokushesha ngaphambi kwenqubo ye-soldering noma ye-soldering ukuze kugcinwe ukusebenza kwayo.
Isinyathelo sesi-4: I-Surface Coating
Izembatho ezingaphezulu zisiza ukuvikela izindawo ezingaphezulu ezimeni zemvelo, zivikele ukugqwala futhi zithuthukise ukubukeka kwazo.
Ngaphambi kokusebenzisa i-coating, lungiselela ngokwemiyalelo yomkhiqizi. Gcoba ijazi ngokucophelela usebenzisa ibhulashi, i-roller noma isifutho, uqinisekise ukumbozwa okulinganayo futhi okubushelelezi. Qaphela isikhathi esinconyiwe sokumisa noma ukuphulukiswa phakathi kwamajazi. Ukuze uthole imiphumela engcono kakhulu, gcina izimo ezifanele zemvelo njengezinga lokushisa kanye namazinga omswakama ngesikhathi sokwelapha.
Isinyathelo sesi-5: Inqubo yangemuva kokucubungula
Inqubo yokwelashwa ngemva kokwelashwa ibalulekile ukuze kuqinisekiswe ubude besikhathi sokumbozwa kwendawo kanye nekhwalithi yonke yendawo elungiselelwe.
Ngemuva kokuthi ukugqoka sekuphulukiswe ngokugcwele, hlola noma yikuphi ukungapheleli, ama-bubbles noma ukungalingani. Lungisa lezi zinkinga ngokusandeni noma ngokupholisha indawo engaphezulu, uma kunesidingo. Ukugcinwa okuvamile nokuhlolwa kubalulekile ukuze kubonakale noma yiziphi izimpawu zokuguga noma zokulimala kwentokozo ukuze ilungiswe ngokushesha noma ifakwe kabusha uma kudingeka.

5.Ukulawula Ikhwalithi Nokuhlola ku-FPC flex PCB yokukhiqiza inqubo yokwelashwa kwendawo:

Ukulawulwa kwekhwalithi nokuhlolwa kubalulekile ukuze kuqinisekiswe ukusebenza kahle kwezinqubo zokulungiswa kwendawo. Lesi sigaba sizodingida izindlela zokuhlola ezihlukahlukene, okuhlanganisa ukuhlola okubonakalayo, ukuhlola ukunamathela, ukuhlola ukuthengiselana, nokuhlola ukwethembeka, ukuze kuqinisekiswe ikhwalithi engaguquki nokuthembeka kokukhiqizwa kwe-FPC Flex PCBs ephathwa ngaphandle.

Ukuhlola okubonakalayo:
Ukuhlola okubonakalayo kuyisinyathelo esiyisisekelo kodwa esibalulekile sokulawula ikhwalithi. Kubandakanya ukuhlola ngokubonakalayo ingaphezulu le-PCB ukuze kutholakale noma yikuphi ukukhubazeka okufana nokuklwebheka, ukukhishwa kwe-oxidation noma ukungcoliswa. Lokhu kuhlola kungasebenzisa okokusebenza kokubona noma isibonakhulu ukuze kutholwe noma ikuphi okudidayo okungase kuthinte ukusebenza noma ukwethembeka kwe-PCB.
Ukuhlola Ukunamathela:
Ukuhlolwa kokunamathela kusetshenziselwa ukuhlola amandla okunamathela phakathi kokwelashwa okungaphezulu noma ukunamathela kanye ne-substrate engaphansi. Lokhu kuhlola kuqinisekisa ukuthi isiphetho siboshelwe ngokuqinile ku-PCB, kuvimbela noma yikuphi ukukhishwa ngaphambi kwesikhathi noma ukuxebuka. Ngokuya ngezidingo namazinga athile, izindlela ezihlukene zokuhlola ukunamathela zingasetshenziswa, njengokuhlola itheyiphu, ukuhlolwa kokuklwebheka noma ukuhlolwa kokudonsa.
Ukuhlolwa kwe-Solderability:
Ukuhlolwa kwe-solderability kuqinisekisa ikhono lokwelapha okungaphezulu ukuze kube lula inqubo ye-solderability. Lokhu kuhlolwa kuqinisekisa ukuthi i-PCB ecutshunguliwe iyakwazi ukwenza amajoyinti e-solder aqinile futhi athembekile anezingxenye ze-elekthronikhi. Izindlela ezijwayelekile zokuhlola ukutholakala kwe-solderability zifaka ukuhlolwa kokuntanta kwe-solder, ukuhlola ibhalansi ye-solder wetting, noma ukuhlolwa kokulinganisa ibhola le-solder.
Ukuhlola Ukuthembeka:
Ukuhlola ukwethembeka kuhlola ukusebenza kwesikhathi eside nokuqina kwama-FPC Flex PCB alashwe phezulu ngaphansi kwezimo ezihlukahlukene. Lokhu kuhlola kuvumela abakhiqizi ukuthi bahlole ukumelana kwe-PCB nokuhamba ngebhayisikili, umswakama, ukugqwala, ukucindezeleka komshini, nezinye izici zemvelo. Ukuhlolwa kwempilo okusheshisiwe kanye nokuhlolwa kokulingisa kwemvelo, okufana nokuhamba ngebhayisikili elishisayo, ukuhlolwa kwesifutho sikasawoti noma ukuhlola ukudlidliza, kuvame ukusetshenziselwa ukuhlola ukwethembeka.
Ngokusebenzisa ukulawulwa kwekhwalithi okuphelele kanye nezinqubo zokuhlola, abakhiqizi bangaqinisekisa ukuthi ama-FPC Flex PCB alashwe ngaphandle athobela izindinganiso nezicaciso ezidingekayo. Lezi zinyathelo zisiza ukuthola noma yikuphi ukukhubazeka noma ukungahambisani kusenesikhathi enqubweni yokukhiqiza ukuze izinyathelo zokulungisa zithathwe ngesikhathi futhi kuthuthukiswe ikhwalithi yomkhiqizo kanye nokwethembeka.

6.Ukuxazulula izinkinga zokulungiswa kwendawo ekukhiqizeni i-FPC flex PCB:

Izinkinga zokwelashwa kwendawo zingase zenzeke phakathi nenqubo yokukhiqiza, kuthinte ikhwalithi iyonke kanye nokusebenza kwe-FPC eguquguqukayo ye-PCB. Lesi sigaba sizohlonza izinkinga ezivamile zokulungiswa kwendawo futhi sinikeze amathiphu okuxazulula inkinga ukuze unqobe ngempumelelo lezi zinselele.

Ukunamathela Okungalungile:
Uma isiphetho singanamatheli kahle ku-substrate ye-PCB, kungase kubangele ukubola noma ukuxebuka. Lokhu kungase kube ngenxa yokuba khona kokungcola, ubuhwaba obunganele, noma ukungasebenzi kahle kwendawo. Ukuze ulwe nalokhu, qiniseka ukuthi indawo ye-PCB ihlanzwe kahle ukuze kukhishwe noma yikuphi ukungcola noma izinsalela ngaphambi kokuphatha. Ukwengeza, kwandisa ukuhwalala kwendawo futhi uqinisekise izindlela ezifanele zokuvula indawo, njengokwelashwa kwe-plasma noma ukwenza kusebenze amakhemikhali, asetshenziselwa ukuthuthukisa ukunamathela.
I-coating engalingani noma ubukhulu be-plating:
Ukujiya okungalingani noma ugqinsi lwe-plating kungaba umphumela wokulawulwa kwenqubo okunganele noma ukuhluka kobunzima obungaphezulu. Le nkinga ithinta ukusebenza nokuthembeka kwe-PCB. Ukuze unqobe le nkinga, sungula futhi uqaphe amapharamitha enqubo afanelekile njengokumboza noma isikhathi sokucwenga, izinga lokushisa kanye nokugxila kwesixazululo. Prakthiza amasu afanele okuyaluza noma okunyakazisa ngesikhathi sokumboza noma ukucwenga ukuze uqinisekise ukusatshalaliswa okufanayo.
I-Oxidation:
Ama-PCB aphethwe phezulu angase akhiphe i-oxidize ngenxa yokuchayeka kumswakama, emoyeni, noma amanye ama-oxidizing agents. I-oxidation ingaholela ekuthengiseni okubi futhi kunciphise ukusebenza okuphelele kwe-PCB. Ukuze unciphise i-oxidation, sebenzisa ukwelapha okufanelekile okungaphezulu okufana nama-organic coatings noma amafilimu avikelayo ukuze unikeze umgoqo ngokumelene nomswakama kanye nama-oxidizing agents. Sebenzisa izinqubo ezifanele zokuphatha nokugcina ukuze unciphise ukuchayeka emoyeni kanye nomswakama.
Ukungcola:
Ukungcoliswa kwendawo ye-PCB kungaba nomthelela omubi ukunamathela kanye nokuqina kokuqedwa kwendawo. Ukungcola okuvamile kufaka phakathi uthuli, uwoyela, izigxivizo zeminwe, noma izinsalela zezinqubo zangaphambilini. Ukuze ulwe nalokhu, sungula uhlelo lokuhlanza olusebenzayo lokususa noma yikuphi ukungcola ngaphambi kokulungiswa kwendawo. Sebenzisa izindlela ezifanele zokulahla ukuze unciphise ukuthintana ngezandla noma eminye imithombo yokungcola.
I-Solderability Ephansi:
I-solderability engalungile ingabangelwa ukuntuleka kokusebenza kwendawo noma ukungcola endaweni ye-PCB. Ukungatholakali kahle kwe-solderability kungaholela ekulimaleni kwe-weld kanye namalunga abuthakathaka. Ukuze uthuthukise ukuthengiselana, qinisekisa ukuthi izindlela ezifanele zokuvula indawo engaphezulu njengokwelashwa kwe-plasma noma ukwenza kusebenze amakhemikhali zisetshenziselwa ukuthuthukisa ukumanzisa kwendawo ye-PCB. Futhi, sebenzisa uhlelo lokuhlanza olusebenzayo ukuze ususe noma yikuphi ukungcola okungase kuvimbe inqubo yokushisela.

7. Ukuthuthukiswa kwesikhathi esizayo kwe-FPC flex board production surface treatment:

Inkambu yokuqedwa kwendawo yama-PCB aguqukayo e-FPC iyaqhubeka nokuthuthuka ukuze ihlangabezane nezidingo zobuchwepheshe obusafufusa nezinhlelo zokusebenza. Lesi sigaba sizoxoxa ngentuthuko yesikhathi esizayo engase ibe khona ezindleleni zokwelashwa ezingaphezulu njengezinto ezintsha, ubuchwepheshe bokumboza obuthuthukisiwe, nezixazululo ezivumelana nemvelo.

Intuthuko engaba khona esikhathini esizayo sokwelashwa okungaphezulu kwe-FPC ukusetshenziswa kwezinto ezintsha ezinezakhiwo ezithuthukisiwe.Abacwaningi bahlola ukusetshenziswa kwezingubo zenoveli nezinto zokwakha ukuthuthukisa ukusebenza nokuthembeka kwama-PCB aguqukayo e-FPC. Isibonelo, izimbotshana eziziphilisayo ziyacwaningwa, ezingalungisa noma yimuphi umonakalo noma imihuzuko ebusweni be-PCB, ngaleyo ndlela kwandise ukuphila kwayo nokuqina. Ukwengeza, izinto ezinokusebenza okuthuthukisiwe kwe-thermal ziyahlolwa ukuze kuthuthukiswe ikhono le-FPC lokususa ukushisa ukuze kusebenze kangcono izinhlelo zokusebenza ezisezingeni eliphezulu.
Enye intuthuko yesikhathi esizayo ukuthuthukiswa kobuchwepheshe bokumboza obuphambili.Izindlela zokumboza ezintsha ziyathuthukiswa ukuze kuhlinzekwe ukumbozwa okunembe kakhulu nokufanayo endaweni ye-FPC. Amasu afana ne-Atomic Layer Deposition (ALD) kanye ne-Plasma Enhanced Chemical Vapor Deposition (PECVD) avumela ukulawulwa okungcono kogqinsi lwe-coat kanye nokwakheka, okuholela ekuthuthukisweni kokuthengiselana nokunamathela. Lobu buchwepheshe bokumboza obuthuthukisiwe bunamandla okunciphisa ukuhlukahluka kwenqubo nokuthuthukisa ukusebenza kahle kokukhiqiza okuphelele.
Ukwengeza, kukhona ukugcizelela okwandayo ezisombululo zokwelapha endaweni enobungani bemvelo.Ngemithetho ehlala ikhula kanye nokukhathazeka mayelana nomthelela wemvelo wezindlela ezijwayelekile zokulungiswa kwendawo, abacwaningi bahlola ezinye izixazululo eziphephile nezimeme kakhudlwana. Isibonelo, ama-coating asekelwe emanzini athola ukuduma ngenxa yokukhishwa kwawo okuphansi kwe-volatile organic compound (VOC) uma kuqhathaniswa nezindwangu ezithwala i-solvent. Ukwengeza, imizamo iyaqhubeka yokuthuthukisa izinqubo zokuhlanganisa ezingakhiqizi izinto ezinobuthi noma udoti.
Ngamafuphi,inqubo yokwelapha ngaphezulu idlala indima ebalulekile ekuqinisekiseni ukwethembeka nokusebenza kwebhodi elithambile le-FPC. Ngokuqonda ukubaluleka kokulungiswa kwendawo nokukhetha indlela efanele, abakhiqizi bangakhiqiza izifunda eziguquguqukayo eziphezulu ezihlangabezana nezidingo zezimboni ezihlukahlukene. Ukusebenzisa inqubo yokwelashwa kwendawo ehlelekile, ukwenza izivivinyo zokulawula ikhwalithi, kanye nokubhekana ngokuphumelelayo nezindaba zokwelashwa okungaphezulu kuzoba nomthelela empumelelweni nempilo ende yama-PCB aguqukayo e-FPC emakethe.