Ubuchwepheshe bokukhiqiza obuhlukahlukene be-HDI technology PCB

Isingeniso:

Ama-PCB obuchwepheshe be-High-density interconnect (HDI) aguqule imboni yezogesi ngokunika amandla ukusebenza okwengeziwe kumadivayisi amancane, alula. Lawa ma-PCB athuthukile aklanyelwe ukuthuthukisa ikhwalithi yesignali, ukunciphisa ukuphazamiseka komsindo nokukhuthaza ukwenziwa kancane. Kulokhu okuthunyelwe kwebhulogi, sizohlola amasu okukhiqiza ahlukahlukene asetshenziswa ukukhiqiza ama-PCB obuchwepheshe be-HDI. Ngokuqonda lezi zinqubo eziyinkimbinkimbi, uzothola ukuqonda emhlabeni oyinkimbinkimbi wokukhiqiza ibhodi lesifunda eliphrintiwe nokuthi lifaka isandla kanjani ekuthuthukisweni kobuchwepheshe besimanje.

1. I-Laser Direct Imaging (LDI) :

I-Laser Direct Imaging (LDI) ubuchwepheshe obudumile obusetshenziselwa ukwakha ama-PCB ngobuchwepheshe be-HDI. Ingena esikhundleni sezinqubo ze-photolithography zendabuko futhi ihlinzeka ngamakhono okwenza iphethini anembe kakhudlwana. I-LDI isebenzisa i-laser ukuveza ngokuqondile i-photoresist ngaphandle kwesidingo semaski noma i-stencil. Lokhu kuvumela abakhiqizi ukuthi bafinyelele osayizi besici abancane, ukuminyana kwesekethe okuphezulu, nokunemba okuphezulu kokubhalisa.

Ukwengeza, i-LDI ivumela ukwakhiwa kwamasekhethi anephimbo elihle, kuncishiswe isikhala phakathi kwamathrekhi nokuthuthukisa ubuqotho besignali iyonke. Iphinde inike amandla ama-microvias anemba okuphezulu, abalulekile kuma-PCB obuchwepheshe be-HDI. Ama-Microvias asetshenziselwa ukuxhuma izingqimba ezihlukene ze-PCB, ngaleyo ndlela andise ukuminyana kwemizila kanye nokwenza ngcono ukusebenza.

2. Isakhiwo Esilandelanayo (SBU):

I-sequential assembly (SBU) ingobunye ubuchwepheshe bokukhiqiza obubalulekile obusetshenziswa kabanzi ekukhiqizeni i-PCB kubuchwepheshe be-HDI. I-SBU ibandakanya ukwakhiwa kwesendlalelo ngesendlalelo se-PCB, okuvumela ukubala okuphezulu kwesendlalelo nobukhulu obuncane. Ubuchwepheshe busebenzisa izendlalelo eziningi ezinqwabelene ezacile, ngayinye inokuxhumana kwayo nama-vias.

Ama-SBU asiza ukuhlanganisa amasekhethi ayinkimbinkimbi abe yizici zefomu encane, awenze alungele amadivayisi kagesi ahlangene. Inqubo ihilela ukusebenzisa isendlalelo se-dielectric evikelayo bese udala ukujikeleza okudingekayo ngokusebenzisa izinqubo ezifana ne-additive plating, etching kanye nokubhoboza. Ama-Vias abe esekwakhiwa ngokumba nge-laser, ukubhola ngomshini noma kusetshenziswa inqubo ye-plasma.

Ngesikhathi senqubo ye-SBU, ithimba elikhiqizayo lidinga ukugcina ukulawulwa kwekhwalithi okuqinile ukuze kuqinisekiswe ukuqondana okuphelele nokubhaliswa kwezingqimba eziningi. Ukubhola nge-laser kuvame ukusetshenziselwa ukwakha ama-microvias amancane, ngaleyo ndlela kukhulisa ukwethembeka kanye nokusebenza kwama-PCB obuchwepheshe be-HDI.

3. Ubuchwepheshe bokukhiqiza obuhlanganisiwe:

Njengoba ubuchwepheshe buqhubeka nokuvela, ubuchwepheshe bokukhiqiza obuxubile buye baba yisixazululo esithandwayo sama-PCB obuchwepheshe be-HDI. Lobu buchwepheshe buhlanganisa izinqubo zendabuko nezithuthukile ukuze kuthuthukiswe ukuguquguquka, ukuthuthukisa ukusebenza kahle kokukhiqiza kanye nokuthuthukisa ukusetshenziswa kwezinsiza.

Indlela eyodwa eyingxube iwukuhlanganisa ubuchwepheshe be-LDI ne-SBU ukuze kwakhiwe izinqubo zokukhiqiza ezisezingeni eliphezulu. I-LDI isetshenziselwa ukwenza amaphethini okunembile kanye namasekhethi anephimbo elihle, kuyilapho i-SBU ihlinzeka ngokwakhiwa kwesendlalelo nesendlalelo esidingekayo kanye nokuhlanganiswa kwamasekhethi ayinkimbinkimbi. Le nhlanganisela iqinisekisa ukukhiqizwa okuphumelelayo kwama-PCB aphezulu, asebenza kahle kakhulu.

Ngaphezu kwalokho, ukuhlanganiswa kobuchwepheshe bokuphrinta be-3D nezinqubo zokukhiqiza ze-PCB zendabuko kusiza ukukhiqizwa kobunjwa obuyinkimbinkimbi nezakhiwo ze-cavity ngaphakathi kwama-PCB wobuchwepheshe be-HDI. Lokhu kuvumela ukuphathwa okungcono kokushisa, ukunciphisa isisindo kanye nokuzinza okuthuthukisiwe kwemishini.

Isiphetho:

Ubuchwepheshe bokukhiqiza obusetshenziswa kuma-PCB Obuchwepheshe be-HDI budlala indima ebalulekile ekushayeleni okusha nokudala izinto ezithuthukisiwe zikagesi. Ukuthwebula kwe-laser okuqondile, ukwakha okulandelanayo kanye nobuchwepheshe bokukhiqiza obuyingxubevange bunikeza izinzuzo ezihlukile ezicindezela imingcele ye-miniaturization, ubuqotho besignali kanye nokuminyana kwesekhethi. Ngokuthuthuka okuqhubekayo kobuchwepheshe, ukuthuthukiswa kobuchwepheshe obusha bokukhiqiza kuzothuthukisa amakhono e-HDI technology PCB futhi kukhuthaze inqubekelaphambili eqhubekayo yemboni yezogesi.