I-Double-Layer FR4 Amabhodi Esekethe Aphrintiwe
Ikhono lenqubo ye-PCB
| Cha. | Iphrojekthi | Izinkomba zobuchwepheshe |
| 1 | Isendlalelo | 1-60(ungqimba) |
| 2 | Indawo yokucubungula ephezulu | 545 x 622 mm |
| 3 | Ubuncane bobukhulu | 4(ungqimba)0.40mm |
| 6(ungqimba) 0.60mm | ||
| 8(ungqimba) 0.8mm | ||
| 10(ungqimba)1.0mm | ||
| 4 | Ububanzi bomugqa obuncane | 0.0762mm |
| 5 | Isikhala esincane | 0.0762mm |
| 6 | Imbobo encane yomshini | 0.15mm |
| 7 | Imbobo yodonga lwethusi ukujiya | 0.015mm |
| 8 | Ukubekezelelwa kwe-metalized aperture | ±0.05mm |
| 9 | Ukubekezelela ukungena kwe-metallized | ±0.025mm |
| 10 | Ukubekezelelana kwezimbobo | ±0.05mm |
| 11 | Ukubekezelela Dimensional | ±0.076mm |
| 12 | Ibhuloho elincane le-solder | 0.08mm |
| 13 | Ukumelana ne-insulation | 1E+12Ω (evamile) |
| 14 | Isilinganiso sobukhulu bepuleti | 1:10 |
| 15 | Ukushaqeka okushisayo | 288 ℃ (izikhathi ezi-4 ngemizuzwana eyi-10) |
| 16 | Ihlanekezelwe futhi igobile | ≤0.7% |
| 17 | Amandla okulwa nogesi | ＞1.3KV/mm |
| 18 | Amandla okulwa nokuhlubula | 1.4N/mm |
| 19 | I-Solder imelana nobunzima | ≥6H |
| 20 | Ukuncipha komlilo | 94V-0 |
| 21 | Ukulawulwa kwe-impedance | ±5% |
Senza Amabhodi Esifunda Aphrintiwe anolwazi lweminyaka engu-15 ngobungcweti bethu
4 ungqimba Amabhodi Flex-Rigid
8 ungqimba we-Rigid-Flex PCBs
8 ungqimba HDI Amabhodi Esifunda Aphrintiwe
Izisetshenziswa zokuhlola nokuhlola
Ukuhlola Isibonakhulu
Ukuhlolwa kwe-AOI
Ukuhlolwa kwe-2D
Ukuhlolwa kwe-Impedans
Ukuhlolwa kwe-RoHS
I-Flying Probe
Umhloli Ovundlile
Ukugoba i-Teste
Isevisi yethu Yebhodi Lesifunda Ephrintiwe
. Ukuhlinzeka ngosekelo lobuchwepheshe Ukuthengisa kwangaphambili kanye nangemuva kokuthengisa;
. Yenza ngokwezifiso izendlalelo ezingafika kwezingama-40, i-1-2days ijika ngokushesha i-prototyping, ukuthengwa kwengxenye, i-SMT Assembly;
. Ibhekelela kokubili Idivayisi Yezokwelapha, Ukulawulwa Kwezimboni, Izimoto, Izindiza, I-Consumer Electronics, i-IOT, i-UAV, Ezokuxhumana njll.
. Amaqembu ethu onjiniyela nabacwaningi bazinikele ekugcwaliseni izidingo zakho ngokunemba nangobuchwepheshe.
Amabhodi Esifunda Aphrintiwe we-FR4 anengqimba ekabili asetshenziswa kumathebulethi
1. Ukusabalalisa amandla: Ukusatshalaliswa kwamandla kwe-PC yethebhulethi kusebenzisa izendlalelo ezimbili ze-FR4 PCB. Lawa ma-PCB anika amandla umzila ophumelelayo wezintambo zamandla ukuze kuqinisekiswe amazinga afanele kagesi kanye nokusatshalaliswa ezingxenyeni ezihlukahlukene zethebhulethi, okuhlanganisa isibonisi, iphrosesa, inkumbulo namamojula okuxhumana.
2. Umzila wesignali: I-FR4 PCB enezingqimba ezimbili inikeza izintambo ezidingekayo kanye nendlela yokudlulisa isignali phakathi kwezingxenye ezahlukene namamojula kukhompuyutha yethebhulethi. Baxhuma amasekethe ahlanganisiwe ahlukahlukene (ama-IC), izixhumi, izinzwa, nezinye izakhi, ukuqinisekisa ukuxhumana okufanele nokudluliswa kwedatha ngaphakathi kwamadivayisi.
3. Ukukhweza Ingxenye: I-FR4 PCB enezendlalelo ezimbili iklanyelwe ukuthwala ukukhwezwa kwezingxenye ezihlukahlukene ze-Surface Mount Technology (SMT) kuthebhulethi. Lokhu kufaka phakathi ama-microprocessors, amamojula wememori, ama-capacitor, ama-resistors, ama-circuits ahlanganisiwe nezixhumi. Isakhiwo nedizayini ye-PCB iqinisekisa isikhala esifanele nokuhlelwa kwezingxenye ukuze kuthuthukiswe ukusebenza nokunciphisa ukuphazamiseka kwesignali.
4. Usayizi nokubumbana: Ama-FR4 PCB aziwa ngokuqina kwawo kanye nephrofayili yawo mncane uma kuqhathaniswa, okuwenza afanelekele ukusetshenziswa kumadivayisi ahlangene njengamathebulethi. Ama-PCB anezendlalelo ezimbili ze-FR4 avumela ukuminyana kwezingxenye ezinkulu endaweni elinganiselwe, okwenza abakhiqizi bakwazi ukuklama amaphilisi amancane nalula ngaphandle kokuphazamisa ukusebenza kwawo.
5. Ukusebenza kahle kwezindleko: Uma kuqhathaniswa nama-substrates e-PCB athuthuke kakhulu, i-FR4 iwumsebenzi othengekayo. Ama-PCB anezingqimba ezimbili ze-FR4 ahlinzeka ngesixazululo esingabizi kakhulu kubakhiqizi bamathebulethi abadinga ukugcina izindleko zokukhiqiza ziphansi ngenkathi begcina ikhwalithi nokwethembeka.
I-Double-layer FR4 Printed Circuit Boards ithuthukisa kanjani ukusebenza nokusebenza kwamathebhulethi?
1. Izindiza eziphansi nezinamandla: Ama-PCB anezendlalelo ezimbili ze-FR4 ngokuvamile anezindiza ezizinikezele ezisekelwe phansi namandla ukusiza ukwehlisa umsindo nokuthuthukisa ukusatshalaliswa kwamandla. Lezi zindiza zisebenza njengesithenjwa esizinzile sobuqotho besignali futhi zinciphisa ukuphazamiseka phakathi kwamasekhethi ahlukene nezingxenye.
2. Ukulawulwa kwe-impedance routing: Ukuze kuqinisekiswe ukudluliswa kwesignali okuthembekile futhi kuncishiswe ukuncishiswa kwesignali, umzila olawulwayo we-impedance usetshenziswa ekwakhiweni kwe-double-layer FR4 PCB. Lawa mathrekhi aklanywe ngokucophelela ngobubanzi obuthile nesikhala ukuze ahlangabezane nezimfuneko zokuthikamezeka kwamasignali anesivinini esiphezulu kanye nezindawo ezifana ne-USB, i-HDMI noma i-WiFi.
3. Ukuvikela i-EMI/EMC: I-FR4 PCB enezingqimba ezimbili ingasebenzisa ubuchwepheshe bokuvikela ukuze kuncishiswe ukuphazamiseka kwe-electromagnetic (EMI) nokuqinisekisa ukuhambisana kwe-electromagnetic (EMC). Izendlalelo zethusi noma ukuvikela kungangezwa kumklamo we-PCB ukuze kuhlukaniswe ukujikeleza okuzwelayo emithonjeni yangaphandle ye-EMI futhi kuvinjwe ukukhishwa okungase kuphazamise amanye amadivayisi noma amasistimu.
4. Ukucatshangelwa kwedizayini yefrikhwensi ephezulu: Kumathebulethi aqukethe izingxenye zemvamisa ephezulu noma amamojula afana nokuxhunywa kweselula (LTE/5G), i-GPS noma i-Bluetooth, idizayini ye-double-layer FR4 PCB idinga ukucabangela ukusebenza kwemvamisa ephezulu. Lokhu kuhlanganisa ukufanisa i-impedance, i-crosstalk elawulwayo kanye namasu afanele omzila we-RF ukuze kuqinisekiswe ubuqotho besiginali nokulahlekelwa okuncane kokudlulisela.
